ATS-02A-62-C2-R0
AI

The **ATS-02A-62-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for securing cooling solutions to PCBs.
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### 1. Technical Specifications
Below are the primary electronic and physical specifications for the part:
| Parameter | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Plastic) |
| **Thermal Resistance** | 16.48°C/W (Unducted Flow @ 100 LFM) |
| **Weight** | 33.72 grams |
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### 2. Physical Dimensions
Precision is critical for PCB layout and clearance. The dimensions for this specific model are as follows:
* **Length (A):** 40.00 mm
* **Width (B):** 40.00 mm
* **Height (C):** 15.00 mm
* **Pitch (E):** 45.00 mm (Distance between push-pins)
* **Pitch (F):** 45.00 mm
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### 3. Key Electronic Cooling Characteristics
#### A. Thermal Resistance Performance
The effectiveness of the heat sink changes based on the airflow (Measured in Linear Feet per Minute - LFM):
| Airflow Velocity | 100 LFM | 200 LFM | 300 LFM | 400 LFM | 500 LFM |
| :--- | :--- | :--- | :--- | :--- | :--- |
| **Resistance (°C/W)** | 16.48 | 6.17 | 3.46 | 2.55 | 2.07 |
#### B. Mounting System
* **Push-Pin Mechanism:** Uses a brass or plastic pin with a compressed spring to provide consistent pressure. This ensures optimal contact between the heat sink base and the electronic component (CPU, GPU, or MOSFET).
* **TIM (Thermal Interface Material):** This part usually comes pre-applied with **T766** thermal phase change material or similar, which fills microscopic air gaps between the chip and the aluminum base.
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### 4. Part Number Breakdown
The nomenclature `ATS-02A-62-C2-R0` translates to:
* **ATS:** Manufacturer prefix.
* **02:** Series/Revision.
* **A:** Specific design variant.
* **62:** Fin pattern or size code.
* **C2:** Material/Finish code (Blue Anodized).
* **R0:** RoHS compliance status.
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- ⤷
What are the recommended PCB hole diameters for the push-pin mounting of this heat sink?
- ⤷ How does the 'Blue Anodized' finish affect the emissivity and thermal performance?
- ⤷ Can this heat sink be used with a custom thermal pad instead of the pre-applied T766 material?