The **ATS-02F-101-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-02F-101-C3-R0 | | **Attachment Method** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 6.77°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | | **Fin Style** | Straight Fin | --- ## Key Features & Construction ### 1. The pushPIN™ Attachment System The "R0" series features a unique **pushPIN™** system. Instead of using messy adhesives or thermal tape, this part uses a spring-loaded mechanism that provides: * **Consistent Pressure:** Ensures maximum contact between the heat sink and the component. * **Secure Mounting:** Uses pre-drilled holes in the PCB. * **Ease of Maintenance:** Can be removed and reinstalled without damaging the board. ### 2. Material and Coating * **Aluminum 6063:** Chosen for its excellent balance of thermal conductivity and weight. * **Blue Anodized Finish:** The blue coating isn't just aesthetic; it protects the aluminum from corrosion and slightly improves heat radiation (emissivity). ### 3. Thermal Interface Material (TIM) The "C3" in the part number indicates that this unit comes with **pre-applied phase-change material** or a high-performance thermal pad. This ensures that micro-gaps between the chip and the heat sink are filled, optimizing heat transfer immediately out of the box. --- ## Component Application This specific size (45mm x 45mm) and height (30mm) is commonly found in: * **Telecommunications:** Cooling networking switches and routers. * **Industrial PCs:** High-reliability embedded systems. * **Power Electronics:** Dissipating heat from large MOSFETs or IGPT modules. ---