The **ATS-02F-98-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **heat sink** manufactured by Advanced Thermal Solutions (ATS) as part of their "pushPIN™" line. --- ### 1. Technical Specifications The following table highlights the physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Dimensions** | 45mm x 45mm x 20mm | | **Thermal Resistance** | 15.31 °C/W (Unducted @ 100 LFM) | | **Airflow Direction** | Vertical/Omni-directional | | **Compliance** | RoHS-6 and REACH compliant | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by Advanced Thermal Solutions: 1. **ATS**: Manufacturer (Advanced Thermal Solutions). 2. **02**: Series/Attachment style. 3. **F**: Fin pitch/density (Standard or Fine). 4. **98**: Specific geometric design/template. 5. **C2**: Material and Thermal Interface Material (TIM) code. "C2" typically indicates high-performance T766 phase-change material. 6. **R0**: Revision or specific packaging code. --- ### 3. Key Features & Components * **Fin Design:** It uses a **cross-cut** or pin-fin design. This allows for multi-directional airflow, making it ideal for systems where the air direction might change or is turbulent. * **PushPIN™ Attachment:** Instead of messy adhesives or simple clips, this uses a spring-loaded mechanism. This ensures: * Consistent pressure (preload) on the chip. * Secure mounting during vibration or shipping. * **Thermal Interface Material (TIM):** It comes pre-applied with a high-performance thermal pad/paste, reducing the thermal resistance between the semiconductor (CPU/GPU/FPGA) and the aluminum. --- ### 4. Common Applications This heat sink is designed for mid-range heat dissipation in electronic assemblies: * **Telecommunications:** Routers, switches, and base stations. * **Embedded Systems:** Industrial PCs and single-board computers. * **Power Electronics:** Cooling MOSFETs or power regulators.