The **ATS-03B-32-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is designed for cooling electronic components, specifically integrated circuits (ICs) like processors, FPGAs, and ASICs. Below is the technical breakdown of its electronic and mechanical specifications. ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Body), Copper (Optional Base inserts in some models) | | **Thermal Resistance** | 21.46°C/W (Unducted Flow @ 100 LFM) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Dimensions (L x W)** | 54.00mm x 54.00mm | | **Height** | 12.70mm | | **Finish** | Blue Anodized | --- ### 2. Key Design Elements #### A. Fin Profile (Straight Fin) The "B" in the part number indicates a **straight-fin** geometry. This design is optimized for environments where there is a consistent direction of airflow. Straight fins provide a lower pressure drop compared to cross-cut fins, making them efficient for high-velocity cooling. #### B. pushPIN™ Attachment System Instead of using messy thermal adhesives or tapes, this part uses a mechanical **push-pin** system. * **Spring-loaded:** Ensures consistent pressure (clamping force) against the electronic component. * **Reliability:** Reduces the risk of the heat sink falling off due to vibration or thermal cycling. #### C. Thermal Interface Material (TIM) The "C2" suffix typically denotes that the heat sink comes pre-applied with a high-performance **Phase Change Material (PCM)** or thermal grease. This fills the microscopic air gaps between the IC and the heat sink to maximize heat transfer. --- ### 3. Thermal Performance Matrix The effectiveness of this heat sink depends on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Air Velocity | 100 LFM | 300 LFM | 500 LFM | 700 LFM | | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (°C/W)** | 21.46 | 6.07 | 3.66 | 2.93 | --- ### 4. Application Use Cases * **Telecommunications:** Cooling of networking switches and routers. * **Embedded Systems:** Industrial PCs where height constraints (12.7mm) are a factor. * **Power Electronics:** Dissipating heat from MOSFET arrays or voltage regulators.