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  • ATS-03B-36-C2-R0

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    The **ATS-03B-36-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series, designed specifically for cooling electronic components such as CPUs, GPUs, FPGAs, and ASICs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 36.83mm x 36.83mm | | **Height** | 17.78mm | | **Attachment Method** | pushPIN™ (Brass pins) | | **Thermal Resistance** | 5.90°C/W (at 200 LFM) | | **Base Surface** | Flat, designed for thermal interface material | | **Fin Style** | maxiFLOW (Tapered Fin Design) | --- ### 2. Key Electronic Features While a heat sink is a passive component, its electronic utility is defined by its mechanical compatibility and thermal efficiency: * **Tapered Fin Design:** The unique "maxiFLOW" geometry increases the surface area for heat dissipation while maintaining a low pressure drop, allowing air to flow more effectively across the electronic component. * **pushPIN™ Attachment:** This model uses a secure, spring-loaded pin mechanism. This ensures consistent pressure against the chip, which is critical for maximizing the effectiveness of the **Thermal Interface Material (TIM)**. * **EMI Shielding Consideration:** Because it is made of aluminum, the heat sink can influence the Electromagnetic Interference (EMI) profile of a high-speed PCB, though its primary function is strictly thermal management. * **Thermal Performance:** * **Low Flow (200 LFM):** 5.90°C/W * **High Flow (700 LFM):** 2.50°C/W --- ### 3. Application Use Cases This part is typically integrated into the following electronic assemblies: 1. **Networking Hardware:** Switches and routers where airflow is directional. 2. **Industrial Controls:** Cooling power MOSFETs or high-speed processors in rugged environments. 3. **Power Electronics:** Dissipating heat from DC-DC converters or motor drivers. --- ### 4. Part Number Breakdown * **ATS:** Manufacturer (Advanced Thermal Solutions) * **03:** Product Series * **B:** Attachment Type (pushPIN) * **36:** Dimensions (approximate footprint) * **C2:** Material/Color (Blue Anodized Aluminum) * **R0:** Revision/Packaging code
    ✨ Follow-up Questions
    • ⤷ What are the recommended thermal interface materials for this heat sink?
    • ⤷ How does the pushPIN mounting system compare to adhesive tape?
    • ⤷ What is the maximum power dissipation (Watts) this heat sink can handle?