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The **ATS-03B-36-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **maxiFLOW™** series, designed specifically for cooling electronic components such as CPUs, GPUs, FPGAs, and ASICs.
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### 1. Technical Specifications
The following table outlines the physical and thermal characteristics of this specific part:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized) |
| **Dimensions** | 36.83mm x 36.83mm |
| **Height** | 17.78mm |
| **Attachment Method** | pushPIN™ (Brass pins) |
| **Thermal Resistance** | 5.90°C/W (at 200 LFM) |
| **Base Surface** | Flat, designed for thermal interface material |
| **Fin Style** | maxiFLOW (Tapered Fin Design) |
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### 2. Key Electronic Features
While a heat sink is a passive component, its electronic utility is defined by its mechanical compatibility and thermal efficiency:
* **Tapered Fin Design:** The unique "maxiFLOW" geometry increases the surface area for heat dissipation while maintaining a low pressure drop, allowing air to flow more effectively across the electronic component.
* **pushPIN™ Attachment:** This model uses a secure, spring-loaded pin mechanism. This ensures consistent pressure against the chip, which is critical for maximizing the effectiveness of the **Thermal Interface Material (TIM)**.
* **EMI Shielding Consideration:** Because it is made of aluminum, the heat sink can influence the Electromagnetic Interference (EMI) profile of a high-speed PCB, though its primary function is strictly thermal management.
* **Thermal Performance:**
* **Low Flow (200 LFM):** 5.90°C/W
* **High Flow (700 LFM):** 2.50°C/W
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### 3. Application Use Cases
This part is typically integrated into the following electronic assemblies:
1. **Networking Hardware:** Switches and routers where airflow is directional.
2. **Industrial Controls:** Cooling power MOSFETs or high-speed processors in rugged environments.
3. **Power Electronics:** Dissipating heat from DC-DC converters or motor drivers.
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### 4. Part Number Breakdown
* **ATS:** Manufacturer (Advanced Thermal Solutions)
* **03:** Product Series
* **B:** Attachment Type (pushPIN)
* **36:** Dimensions (approximate footprint)
* **C2:** Material/Color (Blue Anodized Aluminum)
* **R0:** Revision/Packaging code
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What are the recommended thermal interface materials for this heat sink?
- ⤷ How does the pushPIN mounting system compare to adhesive tape?
- ⤷ What is the maximum power dissipation (Watts) this heat sink can handle?