The **ATS-03F-04-C2-R0** is a high-performance electronic thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. Specifically, it belongs to the "push-pin" heat sink series designed for cooling integrated circuits (ICs) and surface-mount devices (SMDs). --- ### ## Technical Specifications Below are the primary mechanical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Product Type** | Heat Sink | | **Attachment Method** | Push-Pin (Plastic) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 40mm x 40mm | | **Height** | 20mm | | **Thermal Resistance** | 11.58°C/W (Unducted Flow @ 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### ### Key Components and Features #### 1. Heat Sink Geometry * **Fin Style:** Straight fin design. This provides a large surface area for heat dissipation into the surrounding air. * **Material:** Constructed from high-quality aluminum for excellent thermal conductivity and lightweight performance. #### 2. Push-Pin Attachment Mechanism Instead of using messy adhesives or expensive screws, this part uses a **plastic push-pin** system with a built-in spring. * **Spring Load:** Ensures consistent pressure between the heat sink and the electronic component (CPU/GPU/FPGA), which is critical for efficient heat transfer. * **Ease of Assembly:** Allows for fast installation on a Printed Circuit Board (PCB) with pre-drilled holes. #### 3. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. * This material fills microscopic air gaps between the chip and the heat sink. * Pre-application ensures a consistent layer thickness, reducing the risk of installation errors that could lead to overheating. --- ### ### Applications The ATS-03F-04-C2-R0 is typically used for: * **Processors and FPGAs:** High-speed chips that generate significant localized heat. * **Telecommunications:** Networking gear and servers requiring reliable passive cooling. * **Industrial Controls:** Power electronics that operate in environments with varying airflow. ---