The **ATS-03F-102-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed for efficient cooling of electronic components like CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 5.24°C/W (Unducted Flow @ 200 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Fin Style** | Straight (Square) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the cooling characteristics: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **03**: Attachment type (Push-Pin series). * **F**: Fin pitch/density category. * **102**: Specific dimensions and internal geometry code. * **C2**: Color and Finish (Blue Anodized). * **R0**: Revision or RoHS compliance status. --- ### 3. Key Electronic Cooling Components #### A. The Heat Sink Body The body is made of extruded aluminum. Aluminum is chosen for its excellent thermal conductivity-to-weight ratio. The "Blue Anodized" finish is not just for aesthetics; it provides a protective layer against corrosion and slightly improves radiant heat transfer. #### B. Push-Pin Attachment Instead of using messy adhesives or permanent solder, this part uses **Brass Push-Pins** with a spring-loaded mechanism. * **Benefit:** Provides consistent pressure on the component, ensuring maximum contact with the heat source. * **Requirement:** Requires pre-drilled holes on the Printed Circuit Board (PCB). #### C. Thermal Interface Material (TIM) The **T766** material is pre-applied to the base of the heat sink. This is a phase-change or high-performance thermal pad that fills microscopic air gaps between the component and the heat sink to reduce thermal impedance. --- ### 4. Thermal Performance Data Performance varies based on the airflow (Measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 8.22 | | 200 | 5.24 | | 300 | 4.41 | | 400 | 3.96 |