The **ATS-03F-159-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed to provide efficient cooling for electronic components like CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications The following table summarizes the physical and thermal properties of this specific component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 20.00mm | | **Attachment Type** | pushPIN™ | | **Thermal Resistance (Unducted)** | 2.09 °C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 1.10 °C/W @ 100 LFM | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Design Breakdown The "pushPIN™" system is the core electronic/mechanical feature of this part. It replaces standard screw-down methods with a more reliable and consistent pressure system. * **Fins:** The heat sink features a **Fine-Pitch** fin design. This increases the surface area for heat dissipation, making it ideal for high-velocity airflow environments. * **Attachment:** It uses a brass component and a stainless steel spring. The push-pin mechanism ensures there is uniform pressure across the thermal interface material (TIM), preventing air gaps. * **Thermal Interface Material (TIM):** The part comes with **T766** pre-applied. This is a high-performance phase-change material that melts at operating temperatures to fill microscopic surface irregularities between the chip and the heat sink. --- ### 3. Part Number Decoding Understanding the nomenclature helps in identifying its specific application: | Segment | Meaning | | :--- | :--- | | **ATS-03** | Advanced Thermal Solutions Series | | **F** | Fine pitch fin pattern | | **159** | Specific dimension/design iteration | | **C2** | Thermal performance/Material grade (Aluminum) | | **R0** | Revision code/RoHS Compliance | --- ### 4. Application Use Case This part is typically used in: 1. **Telecommunications:** Cooling signal processors in base stations. 2. **Embedded Systems:** For industrial PCs where space is limited but heat generation is high. 3. **Power Electronics:** Dissipating heat from MOSFETs or large power regulators. ---