The **ATS-03F-85-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions, Inc. (ATS)*. It is part of the push-pin style attachment series designed for cooling integrated circuits (ICs) and other electronic chips. --- ### 1. Technical Specifications The following table summarizes the key physical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Dimension (L x W)** | 35mm x 35mm | | **Height** | 10mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 24.11 °C/W (at 100 LFM) | | **Thermal Interface Material (TIM)** | T412 (Double-sided adhesive/pad) | --- ### 2. Breakdown of the Model Number The part number follows a specific nomenclature used by ATS to describe the heat sink's characteristics: * **ATS:** Manufacturer prefix (Advanced Thermal Solutions). * **03:** Indicates the series or specific design family. * **F:** Likely refers to the fin density or specific material configuration. * **85:** Specific dimensional code for the 35mm footprint. * **C3:** Denotes the color/finish and material (typically Blue Anodized Aluminum). * **R0:** Revision code, often indicating the specific attachment hardware (Brass push-pins and springs). --- ### 3. Key Features & Benefits * **Efficiency:** The straight-fin design is optimized for environments with high-velocity airflow, providing low thermal resistance. * **Secure Mounting:** The brass push-pins use a compression spring mechanism. This ensures constant pressure on the chip, improving heat transfer and protecting the component from vibration or shock. * **Ease of Installation:** Pre-drilled holes in the PCB are required, allowing for a tool-less, rapid assembly process during manufacturing. * **Pre-applied TIM:** Comes with a Thermal Interface Material (T412) already applied to the base, ensuring a reliable thermal bond between the heat sink and the component without needing manual paste application. --- ### 4. Applications This part is commonly used in hardware where space is limited but heat dissipation is critical, such as: 1. **Network Switches/Routers:** Cooling ASICs or processors. 2. **Embedded Systems:** Industrial PCs and controllers. 3. **Telecommunications:** High-speed data transmission equipment.