The **ATS-03F-91-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" series designed for securing cooling solutions to PCBs (Printed Circuit Boards). --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Fin Type** | Straight Fin (Extrusion) | | **Thermal Resistance** | ~6.40°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 40mm x 40mm x 10mm | --- ### 2. Component Breakdown #### A. The Heat Sink Body The main body is made of **Aluminum**, chosen for its high thermal conductivity and lightweight properties. The **Blue Anodized** finish is not just for aesthetics; it provides surface protection against corrosion and slightly increases emissivity for better radiative heat transfer. #### B. The Fin Design This model uses a **Straight Fin** geometry. * **Purpose:** It is designed for "cross-flow" or "longitudinal flow" where air moves between the parallel walls. * **Efficiency:** It provides a large surface area for heat to dissipate from the component into the surrounding air. #### C. The Mounting System (Push-Pins) The "F" in the part number often indicates the specific hardware type. This unit uses a **Push-Pin with Spring** mechanism: * **Easy Installation:** No tools are required; the pins snap into pre-drilled holes in the PCB. * **Consistent Pressure:** The spring ensures a constant downward force (interface pressure) between the heat sink and the electronic component (CPU, FPGA, or MOSFET), which is critical for heat transfer. --- ### 3. Usage Context In electronic systems, this part is typically used to cool: 1. **Processors (BGA/FPGA):** Small to medium-sized chips generating 5W–15W of heat. 2. **Power Electronics:** Voltage regulators or motor drivers. 3. **Communication Gear:** Routers and switches where airflow is provided by internal fans. --- ### 4. Thermal Performance Data Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Low) | 6.40 | | 300 (Medium) | 2.50 | | 500 (High) | 1.80 | *[Note: Lower resistance values indicate better cooling performance.]*