The **ATS-03H-33-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **heat sink** manufactured by Advanced Thermal Solutions (ATS) as part of their "pushPIN™" series. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions** | 35mm x 35mm x 20mm | | **Fin Style** | Straight (Square) | | **Thermal Resistance** | 17.42°C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material** | T766 (High Performance Phase Change) | --- ### 2. Component Design & Features #### A. The pushPIN™ Attachment Unlike adhesive tapes or simple clips, this model uses a **pushPIN™ system**. This involves: * **Plastic/Brass Pins:** Inserted through pre-drilled holes in the PCB. * **Stainless Steel Springs:** Provide a precise, consistent compression force (pressure) on the electronic component (CPU, GPU, or MOSFET). * **Ease of Install:** Allows for quick assembly and secure attachment even in high-vibration environments. #### B. Thermal Interface Material (TIM) The part comes pre-applied with **T766 phase-change material**. This eliminates the need for manual application of thermal grease. When the component reaches operating temperature, the material softens to fill microscopic air gaps between the heat sink and the chip, significantly reducing thermal resistance. #### C. Fin Geometry The "Straight" fin design is optimized for **cross-flow air movement**. The specific spacing (pitch) is engineered to balance surface area for heat dissipation with the pressure drop caused by the cooling fan. --- ### 3. Application Use Cases This component is typically used in space-constrained electronics that generate significant heat: 1. **Telecommunications:** Networking switches and routers. 2. **Embedded Systems:** Industrial PCs and controllers. 3. **Power Electronics:** Voltage regulators and high-power LED drivers. 4. **Computing:** Chipset cooling on motherboards. ---