The **ATS-03H-71-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" attachment series, designed for cooling electronic components such as CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications The following table highlights the core technical attributes of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 30.00mm | | **Attachment Type** | Push-Pin (Plastic/Brass) | | **Spring Type** | Compression Spring | | **Thermal Resistance** | 6.69°C/W (Unducted Flow @ 200 LFM) | | **Fin Style** | Straight Fin | --- ### 2. Design and Engineering Features The ATS-03H-71-C2-R0 is engineered for specific thermal management requirements: * **Pre-drilled Holes:** The heat sink comes with pre-drilled holes specifically spaced for the push-pin mounting system, ensuring consistent pressure across the component. * **Thermal Interface Material (TIM):** It typically comes pre-applied with **ATS-PPS-03** or similar high-performance phase-change material to ensure maximum heat transfer from the chip to the aluminum. * **Fin Configuration:** The 30mm height and straight-fin design are optimized for systems with active airflow (fans), allowing air to pass through the fins and carry heat away efficiently. * **Blue Anodization:** This is not just for aesthetics; the anodized layer provides increased corrosion resistance and slightly improves surface emissivity for radiant cooling. --- ### 3. Application Use Cases This component is commonly found in the following electronic environments: 1. **Networking Hardware:** High-speed routers and switches where ASICs generate significant heat. 2. **Industrial PCs:** Compact motherboards that require vibration-resistant mounting (provided by the spring-loaded push pins). 3. **Power Supplies:** Cooling MOSFETs or power regulators in high-density power modules.