The **ATS-03H-75-C1-R0** is a specific electronic component categorized as a **Heatsink**, manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "pushPIN™" series, designed for high-performance cooling of integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (with Blue Anodized Finish) | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Dimensions (L x W x H)** | 25mm x 25mm x 30mm | | **Fin Style** | Straight Fin | | **Thermal Resistance (Unducted)** | 5.23°C/W @ 100 LFM | | **Thermal Resistance (Ducted)** | 1.83°C/W @ 100 LFM | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the heat sink's dimensions and mounting hardware: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **03**: Designates the series or specific base profile. * **H**: Fin Height (in this case, part of a specific height category). * **75**: Width/Length dimension code (25mm x 25mm). * **C1**: Thermal performance/Material code (Aluminum). * **R0**: Version or Revision number (standard). --- ### 3. Key Features and Applications #### Design Features * **Push-Pin Attachment:** Uses a flexible attachment system (sold separately or integrated) that applies constant pressure to the component, ensuring high thermal transfer efficiency. * **Straight Fin Design:** Optimized for vertical or horizontal airflow, providing a large surface area for heat dissipation relative to its small footprint. * **Pre-applied Interface:** Often comes with a Phase Change Material (PCM) or Thermal Interface Material (TIM) on the base to reduce air gaps between the chip and the metal. #### Common Applications * **Processors (CPUs/GPUs):** Used for cooling low-to-medium power chips in embedded systems. * **Networking Hardware:** Cooling switches, routers, and high-speed controllers. * **FPGA Cooling:** Frequently used on Field Programmable Gate Arrays that generate significant localized heat. * **Power Electronics:** Cooling MOSFETs or power regulators in compact enclosures. --- ### 4. Mounting Requirements To install this component, the Printed Circuit Board (PCB) must have specific **mounting holes** to accommodate the push-pins. The standard pitch for this specific model is usually **30mm**, but checking the official datasheet for the exact hole layout is recommended before manufacturing the PCB.