ATS-03H-77-C2-R0
AI

The **ATS-03H-77-C2-R0** is a high-performance thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, and power transistors to ensure their operational stability.
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### 1. Key Technical Specifications
Below is a breakdown of the physical and thermal properties of this specific model:
| Attribute | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ |
| **Dimension (Length x Width)** | 25.00mm x 25.00mm |
| **Height** | 20.00mm |
| **Fin Pitch** | Fine-Pitch |
| **Fin Pattern** | Straight |
| **Thermal Resistance** | 9.30°C/W (at 100 LFM) |
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### 2. Design Features
The part number follows a specific nomenclature used by ATS to describe its functional characteristics:
* **pushPIN™ Attachment:** This model uses a spring-loaded mechanism that ensures consistent pressure between the heat sink and the electronic component, optimizing thermal transfer.
* **High Performance:** The "C2" designation typically refers to a high-performance thermal interface material (TIM) pre-applied to the base, reducing assembly time and improving efficiency.
* **Material Selection:** The aluminum construction offers a balance between lightweight design and effective heat conduction. The **Blue Anodization** protects the metal from corrosion and slightly improves radiant heat transfer.
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### 3. Application Use Cases
This heat sink is typically found in environments where space is limited but thermal loads are high:
1. **Networking & Telecom:** cooling small-form-factor processors in routers or switches.
2. **Industrial PCs:** Maintaining stability for embedded systems.
3. **Consumer Electronics:** High-power LEDs or small power supply units.
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### 4. Thermal Performance Comparison
Performance varies based on the airflow (measured in Linear Feet per Minute - LFM):
| Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) |
| :--- | :--- | :--- |
| 100 | 0.5 | 9.30 |
| 200 | 1.0 | 4.30 |
| 400 | 2.0 | 2.50 |
| 600 | 3.0 | 1.80 |
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What is the significance of the 'pushPIN' mounting system compared to adhesive tapes?
- ⤷ How does the 'C2' thermal interface material impact heat transfer?
- ⤷ Can this heat sink be used in a passive cooling environment without a fan?