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  • ATS-03H-77-C2-R0

  • AI
    The **ATS-03H-77-C2-R0** is a high-performance thermal management component, specifically a **Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, and power transistors to ensure their operational stability. --- ### 1. Key Technical Specifications Below is a breakdown of the physical and thermal properties of this specific model: | Attribute | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimension (Length x Width)** | 25.00mm x 25.00mm | | **Height** | 20.00mm | | **Fin Pitch** | Fine-Pitch | | **Fin Pattern** | Straight | | **Thermal Resistance** | 9.30°C/W (at 100 LFM) | --- ### 2. Design Features The part number follows a specific nomenclature used by ATS to describe its functional characteristics: * **pushPIN™ Attachment:** This model uses a spring-loaded mechanism that ensures consistent pressure between the heat sink and the electronic component, optimizing thermal transfer. * **High Performance:** The "C2" designation typically refers to a high-performance thermal interface material (TIM) pre-applied to the base, reducing assembly time and improving efficiency. * **Material Selection:** The aluminum construction offers a balance between lightweight design and effective heat conduction. The **Blue Anodization** protects the metal from corrosion and slightly improves radiant heat transfer. --- ### 3. Application Use Cases This heat sink is typically found in environments where space is limited but thermal loads are high: 1. **Networking & Telecom:** cooling small-form-factor processors in routers or switches. 2. **Industrial PCs:** Maintaining stability for embedded systems. 3. **Consumer Electronics:** High-power LEDs or small power supply units. --- ### 4. Thermal Performance Comparison Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 9.30 | | 200 | 1.0 | 4.30 | | 400 | 2.0 | 2.50 | | 600 | 3.0 | 1.80 |
    ✨ Follow-up Questions
    • ⤷ What is the significance of the 'pushPIN' mounting system compared to adhesive tapes?
    • ⤷ How does the 'C2' thermal interface material impact heat transfer?
    • ⤷ Can this heat sink be used in a passive cooling environment without a fan?