The **ATS-04A-33-C2-R0** is a specific part number for a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. This component is part of their "pushPIN™" series, designed for cooling electronic components such as CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number itself contains encoded information about its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ (Plastic Pins & Springs) | | **Thermal Resistance** | 17.42 °C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W)** | 35.00 mm x 35.00 mm | | **Height** | 20.00 mm | | **Fin Style** | Flat Fin | | **Thermal Interface** | T766 (Pre-applied Thermal Grease) | --- ### 2. Breakdown of the Part Number Electronic manufacturers use standardized naming conventions. Here is how the ATS-04A-33-C2-R0 is decoded: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **04**: Series or specific mounting hole pattern. * **A**: Fin configuration/density indicator. * **33**: Indicates the length/width (35mm nominal). * **C2**: Material and Finish (Aluminum with Blue Anodized finish). * **R0**: Versioning or packaging code. --- ### 3. Electronic Application & Performance Heat sinks like the ATS-04A-33-C2-R0 are critical for maintaining the reliability of semiconductor devices. #### Cooling Efficiency The performance of this heat sink depends on the airflow (LFM - Linear Feet per Minute). * **Low Airflow (100 LFM):** 17.42 °C/W. * **High Airflow (700 LFM):** 2.62 °C/W. * *Interpretation:* At high airflow, the heat sink is significantly more efficient at dissipating thermal energy away from the silicon die. #### Mounting System The "pushPIN™" system is a specific electronic mechanical assembly that ensures: 1. **Consistent Pressure:** The spring-loaded pins provide uniform contact between the heat sink and the chip. 2. **Tool-less Installation:** Designed for fast assembly on PCBs (Printed Circuit Boards). 3. **Vibration Resistance:** Secure enough for automotive or industrial electronics. --- ### 4. Code Representation (Thermal Analysis Context) If you were simulating the thermal profile of this part in a script, it might be represented as an object: ```python ats_04a_33_c2_r0 = { "manufacturer": "Advanced Thermal Solutions", "type": "Heat Sink", "dimensions": {"length": 35, "width": 35, "height": 20}, "material": "Aluminum 6063", "mounting": "pushPIN", "thermal_resistance_unducted": 17.42, # °C/W at 100 LFM "finish": "Blue Anodized" } ```