The **ATS-04A-35-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" family, designed for cooling sensitive electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Al) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions** | 35.00mm x 35.00mm x 10.00mm | | **Pitch Type** | Fine-Pitch | | **Pattern** | XC (Cross-cut) | | **Thermal Resistance** | 22.48 °C/W (Unducted @ 100 LFM) | --- ### 2. Physical Design Features The electronic design of this part focuses on maximizing heat dissipation within a low-profile footprint: * **XC (Cross-cut) Fin Pattern:** This design creates a grid of small square pins rather than straight fins. This increases the surface area and allows for multi-directional airflow, making it ideal for systems where the air direction might be irregular. * **Low Profile:** At only 10mm high, it is designed for compact enclosures where vertical space is restricted. * **Blue Anodized Coating:** Beyond aesthetics, the anodization protects the aluminum from corrosion and slightly improves surface emissivity for heat radiation. --- ### 3. Attachment Mechanism (pushPIN™) The "R0" suffix refers to the specific attachment kit included. This system replaces traditional adhesives or thermal tape with a more reliable mechanical connection: * **Spring-loaded Bolts:** Use a precise amount of pressure to ensure optimal contact between the heat sink and the electronic component. * **Thermal Interface Material (TIM):** This part usually comes pre-applied with high-performance thermal grease or a pad to fill microscopic air gaps between the chip and the aluminum base. * **Ease of Maintenance:** Unlike epoxy, the pushPIN™ system allows the heat sink to be removed and re-installed without damaging the PCB. --- ### 4. Thermal Performance (Typical Airflow) The effectiveness of this part depends heavily on the airflow (measured in Linear Feet per Minute - LFM): | Airflow Velocity (LFM) | 100 | 200 | 300 | 400 | | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance (Unducted)** | 22.48 | 13.71 | 10.19 | 8.33 | | **Thermal Resistance (Ducted)** | 11.55 | 7.37 | 6.22 | 5.57 | ---