The **ATS-04B-12-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ### 1. Technical Specifications Below are the key physical and thermal properties of this specific component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Brass) with Compression Spring | | **Thermal Resistance** | 15.85°C/W (Unducted Flow @ 200 LFM) | | **Fin Style** | Straight Fin | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 15.00mm | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design Characteristics #### A. Thermal Management The part uses a **Straight Fin** design. This is optimized for airflow that moves in a single direction across the component. The 15mm height makes it a "low profile" solution, suitable for compact server blades or dense electronic enclosures. #### B. Mounting Mechanism (The "Push Pin") The part number suffix includes the mounting hardware details. The **Brass Push Pin** system offers several advantages over adhesive tapes: * **Constant Pressure:** The springs ensure a consistent 20-30 PSI of pressure against the chip, which maximizes heat transfer. * **Reliability:** Mechanical mounting is less likely to fail under vibration or extreme temperature cycles compared to thermal glue. * **Pre-drilled Holes:** This component requires two specific holes to be drilled into the PCB for installation. #### C. Thermal Interface Material (TIM) The **T766** material pre-applied to the base is a high-performance thermal pad. This eliminates the need for manual thermal paste application and ensures that there are no air gaps between the heat sink and the electronic component. --- ### 3. Applications This heat sink is typically found in: 1. **Telecommunications:** High-speed routers and switches. 2. **Computing:** Chipset cooling on motherboards or expansion cards. 3. **Industrial Power:** Cooling for power modules or motor controllers. --- ### 4. Part Number Breakdown Understanding the ATS nomenclature helps in identifying variants: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **04:** Series/Size family. * **B:** Material/Configuration code. * **12:** Specific fin geometry/density. * **C2:** Blue Anodized finish. * **R0:** Revision/Packaging code.