ATS-04D-102-C2-R0
AI

The **ATS-04D-102-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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### 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics:
| Property | Specification | Details |
| :--- | :--- | :--- |
| **Part Number** | ATS-04D-102-C2-R0 | Standard Product Line |
| **Material** | Aluminum | High thermal conductivity and lightweight |
| **Finish** | Blue Anodized | Increases surface emissivity and corrosion resistance |
| **Thermal Resistance** | 5.24°C/W (at 200 LFM) | Rate of heat transfer efficiency |
| **Attachment Method** | push-PIN™ | Uses a spring-loaded pin for secure PCB mounting |
| **Dimensions** | 45mm x 45mm x 25mm | Standard square footprint |
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### 2. Key Components & Design Features
#### A. Fin Profile: XC-Cut
This heat sink features a **straight fin** design with cross-cuts (XC). This configuration is optimized for:
* **Omnidirectional Airflow:** It can accept air from multiple directions, making it versatile for different fan placements.
* **Surface Area:** Maximizes the area in contact with air to increase heat dissipation.
#### B. Attachment: push-PIN™ System
The "04D" in the part number identifies the specific attachment hardware.
* **Spring-loaded Pins:** These ensure a consistent pressure (Pre-assembled) across the component surface for optimal thermal interface material (TIM) performance.
* **Ease of Assembly:** Features pre-drilled holes for quick installation onto PCBs.
#### C. Thermal Interface Material (TIM)
The "C2" suffix typically indicates the type of thermal interface provided:
* **T766 Phase Change Material:** This is a high-performance thermal pad or grease pre-applied to the base, ensuring there are no air gaps between the heat sink and the electronic chip.
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### 3. Application Use-Cases
The ATS-04D-102-C2-R0 is commonly found in the following electronic environments:
1. **Telecommunications:** High-speed routers and switches.
2. **Embedded Systems:** Industrial PCs and automation controllers.
3. **Power Electronics:** Cooling for MOSFETs or power modules where vertical space allows for a 25mm height.
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- ⤷
What is the difference between Blue Anodized and Black Anodized finishes in thermal performance?
- ⤷ How do I calculate if the 5.24°C/W thermal resistance is sufficient for my specific chip?
- ⤷ What are the PCB hole diameter requirements for the push-PIN attachment?