The **ATS-04D-159-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. This specific part belongs to the **push-pin** attachment series, designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The following table summarizes the physical and thermal properties of the component: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-04D-159-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 10.00mm | | **Thermal Resistance** | 10.70°C/W (at 100 LFM) | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design and Component Breakdown #### A. Fin Profile (Straight Fin) The "159" series typically features a **straight fin** design. This is optimized for high-velocity airflow environments (forced convection). The spacing between fins allows air to pass through with minimal pressure drop while maximizing the surface area for heat dissipation. #### B. Push-Pin Mounting Mechanism Unlike adhesive-based heat sinks, this part uses a mechanical fastening system: * **Plastic Push-Pins:** These insert into pre-drilled holes on the PCB. * **Compression Springs:** These apply a consistent downward force (pressure) on the chip, ensuring maximum contact between the heat sink base and the electronic component. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. This is a "Phase Change" or high-performance thermal grease that fills microscopic air gaps between the heat sink and the CPU/GPU, significantly reducing thermal resistance. --- ### 3. Applications and Usage This heat sink is commonly found in the following electronic environments: * **Telecommunications:** Networking switches and routers. * **Embedded Systems:** Industrial PCs and high-speed controllers. * **Power Electronics:** Voltage regulators and power modules that require stable thermal management. --- ### 4. Thermal Performance Data Performance varies based on airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural/Low) | 10.70 | | 300 (Moderate) | 4.40 | | 500 (High) | 3.35 |