The **ATS-04E-142-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "blueICE" series, specifically designed for cooling electronic components like CPUs, GPUs, and FPGAs. --- ### ## Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Property | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 30.00mm x 30.00mm | | **Height** | 15.00mm | | **Attachment Method** | push-PIN™ | | **Thermal Resistance** | 10.07°C/W (at 100 LFM) | | **Airflow Pattern** | Square Fin (Omnidirectional) | --- ### ### Key Electronic Design Features #### 1. Thermal Interface Material (TIM) This part typically comes with a pre-applied **Phase Change Material (PCM)** or high-performance thermal pad. This ensures that the microscopic gaps between the electronic component (die/integrated circuit) and the heat sink are filled, minimizing thermal resistance. #### 2. push-PIN™ Attachment Unlike adhesive tapes, the push-PIN™ mechanism uses a brass or plastic pin with a stainless steel spring. * **Electronic Safety:** Provides precise, uniform pressure across the component to prevent cracking the silicon die. * **Reliability:** Ensures the heat sink stays attached during high-vibration environments or shipping. #### 3. Fin Design (Square Pattern) The fin geometry is optimized for "cross-cut" airflow. In complex electronic enclosures where airflow direction might be unpredictable or obstructed by other components, the omnidirectional design allows heat to dissipate regardless of which way the fans are blowing. --- ### ### Typical Applications * **Network Switches/Routers:** Cooling high-speed processing chips. * **Embedded Systems:** For industrial PCs where vertical space (15mm) is limited. * **Power Supplies:** Heat dissipation for MOSFETs or voltage regulators.