The **ATS-04G-33-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" attachment series designed for cooling integrated circuits (ICs). --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Heat Sink Type** | pushPIN™ Heat Sink | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 36.83mm x 36.83mm | | **Height (Off Base)** | 17.78mm | | **Thermal Resistance** | 17.42°C/W (at 100 LFM) | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Key Components & Construction #### A. Fin Design * **Fin Type:** This model uses **Straight Fins**. * **Purpose:** The vertical fins increase the surface area available for heat dissipation. The orientation is optimized for linear airflow across the PCB. #### B. Push-Pin Attachment Mechanism * The "04G" and "C2" parts of the model number refer to the attachment hardware. * **Hardware:** It utilizes brass push-pins with a compression spring. * **Reliability:** This provides a consistent pressure against the heat source, ensuring optimal contact and improving thermal transfer efficiency compared to simple adhesive tapes. #### C. Thermal Interface Material (TIM) * The unit comes with **T766** pre-applied to the base. * **Function:** This fills microscopic air gaps between the CPU/GPU and the heat sink base to ensure maximum heat conductivity. --- ### 3. Part Number Breakdown (Nomenclature) Understanding the code helps in identifying specific features: | Code Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Brand) | | **04** | Hardware Series (Push-pin type) | | **G** | Attachment Hole Pattern/Spacing | | **33** | Heat Sink Dimensions (36.83mm) | | **C2** | Thermal Performance/Material Grade | | **R0** | RoHS Compliant / Revision Status | --- ### 4. Application Use-Cases This component is typically found in: 1. **Network Switches/Routers:** Cooling ASICs and processing chips. 2. **Industrial PCs:** Maintaining stability in high-temperature environments. 3. **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators.