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  • ATS-04G-49-C2-R0

  • AI
    The **ATS-04G-49-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic packages. It belongs to the **pushPIN™** series manufactured by **Advanced Thermal Solutions (ATS)**. --- ### 1. Technical Specifications The following table outlines the key physical and thermal characteristics of the part: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W)** | 30.00 mm x 30.00 mm | | **Height (Height Off Base)** | 20.00 mm | | **Pitch** | Fine Pitch | | **Thermal Resistance** | 11.88 °C/W (at 100 LFM / 0.5 m/s) | | **Weight** | ~10.43 grams | --- ### 2. Design and Component Breakdown #### A. Fin Geometry (XC-Cut) This heatsink features a **straight-fin** or **cross-cut** design. These fins increase the surface area available for heat dissipation. The "Fine Pitch" configuration is optimized for high-velocity airflow environments (forced convection). #### B. PushPIN™ Attachment System Instead of using messy thermal adhesives or complex screws, this part uses the ATS proprietary **pushPIN™** mechanism. * **Springs:** Pre-assembled compression springs ensure even pressure across the thermal interface. * **Pins:** Plastic or brass pins snap into holes on the Printed Circuit Board (PCB) for secure mounting. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the thermal performance grade. These units typically come with **T766** pre-applied thermal phase-change material or a high-performance grease to ensure maximum heat transfer from the chip to the aluminum base. --- ### 3. Part Number Breakdown (Nomenclature) To understand the specific electronic application, here is how the part number is structured: 1. **ATS:** Manufacturer (Advanced Thermal Solutions). 2. **04:** Series identifier. 3. **G:** Geometry/Attachment style. 4. **49:** Internal dimension/fin code. 5. **C2:** Thermal Performance/TIM type (Blue Anodized finish). 6. **R0:** Revision code. --- ### 4. Application Use-Cases * **Processors:** Cooling CPUs, GPUs, or FPGAs in embedded systems. * **Telecommunications:** Network switches and routers where space is limited but airflow is present. * **Power Electronics:** Dissipating heat from VRMs (Voltage Regulator Modules).
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for mounting the pushPIN system?
    • ⤷ How does the thermal resistance change if the airflow increases to 500 LFM?
    • ⤷ Is this heatsink compatible with standard BGA packages?