ATS-04G-49-C2-R0
AI

The **ATS-04G-49-C2-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic packages. It belongs to the **pushPIN™** series manufactured by **Advanced Thermal Solutions (ATS)**.
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### 1. Technical Specifications
The following table outlines the key physical and thermal characteristics of the part:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W)** | 30.00 mm x 30.00 mm |
| **Height (Height Off Base)** | 20.00 mm |
| **Pitch** | Fine Pitch |
| **Thermal Resistance** | 11.88 °C/W (at 100 LFM / 0.5 m/s) |
| **Weight** | ~10.43 grams |
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### 2. Design and Component Breakdown
#### A. Fin Geometry (XC-Cut)
This heatsink features a **straight-fin** or **cross-cut** design. These fins increase the surface area available for heat dissipation. The "Fine Pitch" configuration is optimized for high-velocity airflow environments (forced convection).
#### B. PushPIN™ Attachment System
Instead of using messy thermal adhesives or complex screws, this part uses the ATS proprietary **pushPIN™** mechanism.
* **Springs:** Pre-assembled compression springs ensure even pressure across the thermal interface.
* **Pins:** Plastic or brass pins snap into holes on the Printed Circuit Board (PCB) for secure mounting.
#### C. Thermal Interface Material (TIM)
The "C2" in the part number indicates the thermal performance grade. These units typically come with **T766** pre-applied thermal phase-change material or a high-performance grease to ensure maximum heat transfer from the chip to the aluminum base.
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### 3. Part Number Breakdown (Nomenclature)
To understand the specific electronic application, here is how the part number is structured:
1. **ATS:** Manufacturer (Advanced Thermal Solutions).
2. **04:** Series identifier.
3. **G:** Geometry/Attachment style.
4. **49:** Internal dimension/fin code.
5. **C2:** Thermal Performance/TIM type (Blue Anodized finish).
6. **R0:** Revision code.
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### 4. Application Use-Cases
* **Processors:** Cooling CPUs, GPUs, or FPGAs in embedded systems.
* **Telecommunications:** Network switches and routers where space is limited but airflow is present.
* **Power Electronics:** Dissipating heat from VRMs (Voltage Regulator Modules).
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What are the PCB hole requirements for mounting the pushPIN system?
- ⤷ How does the thermal resistance change if the airflow increases to 500 LFM?
- ⤷ Is this heatsink compatible with standard BGA packages?