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  • ATS-04G-58-C2-R0

  • AI
    The **ATS-04G-58-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components such as CPUs, GPUs, and high-power chipsets. --- ## 1. Technical Specifications The following table summarizes the primary physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic) | | **Thermal Resistance** | 10.11°C/W (at 200 LFM) | | **Base Dimensions** | 40.00mm x 40.00mm | | **Height** | 25.00mm | | **Fin Style** | Straight Fin | | **Thermal Interface** | T766 (Pre-applied Thermal Phase Change Material) | --- ## 2. Key Features and Electronic Role This part plays a critical role in **thermal management**, ensuring that electronic components do not exceed their maximum operating temperature ($T_j$ or Junction Temperature). ### Thermal Performance * **Dissipation:** It is designed for forced air environments. The thermal resistance decreases significantly as airflow (LFM - Linear Feet per Minute) increases. * **TIM (Thermal Interface Material):** The "C2" in the part number indicates it comes with **T766** pre-applied. This is a high-performance phase-change material that fills microscopic air gaps between the chip and the heat sink base. ### Mechanical Attachment * **Push Pin System:** It uses a brass or plastic push-pin with a compression spring. This ensures a precise amount of downward pressure (clamping force) on the chip, which is vital for optimal heat transfer without cracking the die or damaging the PCB. * **Hole Pattern:** The mounting requires specific pre-drilled holes in the PCB. --- ## 3. Part Number Breakdown Understanding the nomenclature helps in identifying variants: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **04** | Attachment Series (Push Pin style) | | **G** | Aluminum material | | **58** | Size / Height Profile code | | **C2** | Thermal Interface Material (T766) | | **R0** | RoHS Compliant / Revision code | --- ## 4. Typical Applications * **Networking Hardware:** High-speed routers and switches. * **Power Supplies:** Cooling MOSFETs or power regulators. * **Embedded Computing:** Industrial PCs and single-board computers (SBCs).
    ✨ Follow-up Questions
    • ⤷ What is the hole-to-hole spacing required on the PCB for this heat sink?
    • ⤷ How does the thermal resistance change at higher airflow rates like 500 LFM?
    • ⤷ Are there alternative push-pin materials available for high-vibration environments?