ATS-04G-58-C2-R0
AI

The **ATS-04G-58-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of their "push pin" series designed for cooling electronic components such as CPUs, GPUs, and high-power chipsets.
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## 1. Technical Specifications
The following table summarizes the primary physical and thermal properties of the component:
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push Pin (Plastic) |
| **Thermal Resistance** | 10.11°C/W (at 200 LFM) |
| **Base Dimensions** | 40.00mm x 40.00mm |
| **Height** | 25.00mm |
| **Fin Style** | Straight Fin |
| **Thermal Interface** | T766 (Pre-applied Thermal Phase Change Material) |
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## 2. Key Features and Electronic Role
This part plays a critical role in **thermal management**, ensuring that electronic components do not exceed their maximum operating temperature ($T_j$ or Junction Temperature).
### Thermal Performance
* **Dissipation:** It is designed for forced air environments. The thermal resistance decreases significantly as airflow (LFM - Linear Feet per Minute) increases.
* **TIM (Thermal Interface Material):** The "C2" in the part number indicates it comes with **T766** pre-applied. This is a high-performance phase-change material that fills microscopic air gaps between the chip and the heat sink base.
### Mechanical Attachment
* **Push Pin System:** It uses a brass or plastic push-pin with a compression spring. This ensures a precise amount of downward pressure (clamping force) on the chip, which is vital for optimal heat transfer without cracking the die or damaging the PCB.
* **Hole Pattern:** The mounting requires specific pre-drilled holes in the PCB.
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## 3. Part Number Breakdown
Understanding the nomenclature helps in identifying variants:
| Segment | Meaning |
| :--- | :--- |
| **ATS** | Manufacturer (Advanced Thermal Solutions) |
| **04** | Attachment Series (Push Pin style) |
| **G** | Aluminum material |
| **58** | Size / Height Profile code |
| **C2** | Thermal Interface Material (T766) |
| **R0** | RoHS Compliant / Revision code |
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## 4. Typical Applications
* **Networking Hardware:** High-speed routers and switches.
* **Power Supplies:** Cooling MOSFETs or power regulators.
* **Embedded Computing:** Industrial PCs and single-board computers (SBCs).
- ⤷
What is the hole-to-hole spacing required on the PCB for this heat sink?
- ⤷ How does the thermal resistance change at higher airflow rates like 500 LFM?
- ⤷ Are there alternative push-pin materials available for high-vibration environments?