The **ATS-04G-84-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **push-PIN™** series, designed for efficient cooling of semiconductors and integrated circuits (ICs). --- ## 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Brass) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 25.00mm | | **Thermal Resistance (Flowing)** | 1.78 °C/W @ 200 LFM | | **Thermal Resistance (Static)** | 7.00 °C/W @ Ducted flow | | **Interface Material** | T766 (Thermal Tape) | --- ## 2. Key Components & Design Features ### A. Material and Finish * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Finish:** Provides corrosion resistance and slightly improves heat radiation (emissivity). ### B. The push-PIN™ Attachment System Unlike adhesive-only solutions, this part uses a **mechanical push-pin system**. * **Spring-loaded mechanism:** Ensures consistent pressure (clamping force) between the heat sink and the component, optimizing thermal transfer. * **Brass Pins:** Provides durability and a secure fit into pre-drilled PCB holes. ### C. Fin Geometry (Cross-Cut) The "G" in the part number often refers to the **XC (Cross-Cut)** pattern. * This design allows for multi-directional airflow. * It is ideal for high-density electronic assemblies where airflow direction might be inconsistent or obstructed. --- ## 3. Application Use Cases This heat sink is typically used for cooling the following electronic parts: 1. **CPUs / GPUs:** Small form-factor processors. 2. **FPGAs:** Field Programmable Gate Arrays that generate significant heat during high-speed logic operations. 3. **Power Transistors:** Regulating heat in power supply modules. 4. **BGA Packages:** Ball Grid Array chips requiring a 30mm x 30mm footprint. --- ## 4. Thermal Performance Overview The efficiency of the **ATS-04G-84-C2-R0** is highly dependent on airflow (measured in Linear Feet per Minute - LFM): ```text LFM (m/s) | 100 (0.5) | 200 (1.0) | 300 (1.5) | 400 (2.0) | 500 (2.5) ------------------------------------------------------------------------- Thermal Res. | 7.00 | 3.42 | 2.04 | 1.78 | 1.45 (°C/W) ```