The **ATS-04G-93-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for cooling components like CPUs, GPUs, and FPGAs. ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Brass) | | **Spring Type** | Compression Spring | | **Dimensions** | 40mm x 40mm x 20mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | ~7.37°C/W (Unducted Flow) | | **Thermal Interface (TIM)** | T766 (Pre-applied) | --- ### 2. Key Electronic Features #### A. Thermal Management The primary purpose of this part is to dissipate heat from integrated circuits (ICs). By increasing the surface area exposed to airflow, it prevents thermal throttling and potential hardware failure. #### B. Push-Pin Attachment Mechanism Unlike adhesive-based heat sinks, the **ATS-04G-93-C2-R0** uses a mechanical push-pin system. * **Reliability:** Provides constant pressure for better thermal contact. * **Installation:** Requires pre-drilled holes in the PCB. * **Hardware:** Features a brass pin and a stainless steel spring for durability. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a phase-change material that fills microscopic air gaps between the IC and the heat sink, significantly improving heat transfer efficiency. --- ### 3. Dimensional Drawing Representation Below is a simplified structural layout of the component dimensions: ```text 40.00 mm (Width) _______________________ | || || || || | | || || || || | 20.00 mm (Height) |___||___||___||___||___| [_______________________] <-- Base Plate ^ ^ Push Pin Push Pin (32mm spacing typically) ``` ### 4. Application Use-Cases * **Networking Gear:** Cooling chips in routers and switches. * **Industrial PCs:** High-reliability cooling for embedded systems. * **Consumer Electronics:** Supporting high-speed processors in confined spaces. ---