The **ATS-04H-102-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Resistance (Flow)** | 1.83 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 4.12 °C/W (Natural Convection) | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 25.00mm | | **Fin Type** | Fine Pitch (Straight Fin) | --- ## 2. Key Electronic Features ### A. pushPIN™ Attachment System Unlike adhesive-based heat sinks, this model uses the **pushPIN™** system. This involves a spring-loaded pin mechanism that ensures: * **Constant Pressure:** Maintains a consistent interface between the chip and the heat sink for optimal heat transfer. * **Reliability:** Resistant to vibration and thermal expansion, which can cause adhesive pads to fail over time. ### B. Thermal Interface Material (TIM) The "C3" in the part number typically indicates that it comes pre-applied with a high-efficiency **Thermal Interface Material** (usually a phase-change material or high-performance grease). This fills the microscopic air gaps between the electronic component and the aluminum base. ### C. Thermal Performance (LFM) Electronic parts generate heat measured in Watts. The effectiveness of this heat sink is measured by **LFM (Linear Feet per Minute)** of airflow: * **100 LFM:** 1.83 °C/W * **400 LFM:** 0.81 °C/W * **700 LFM:** 0.60 °C/W *(Note: Higher airflow significantly reduces thermal resistance.)* --- ## 3. Physical Layout ```markdown Top View: [ 50mm x 50mm Square ] Side View: [ 25mm Height - Straight Vertical Fins ] Bottom: [ Pre-applied TIM & 2-Point pushPIN Mounting ] ``` --- ## 4. Common Applications * **Telecommunications:** Cooling of high-speed networking processors. * **Industrial PC:** Thermal management for embedded controllers. * **Power Supplies:** Heat dissipation for MOSFETs and IGBTs.