The **ATS-04H-30-C1-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### Technical Specifications The following table summarizes the key physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (with Compression Springs) | | **Dimensions (L x W x H)** | 54.00mm x 53.00mm x 25.00mm | | **Fin Style** | Straight Fin (Cross-Cut) | | **Thermal Resistance** | 5.28°C/W (at 200 LFM) | | **Compatibility** | Standard PCB hole patterns | --- ### Component Breakdown #### 1. Material and Coating * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodization:** This is not just for aesthetics; the anodized layer provides corrosion resistance, electrical insulation (to a degree), and improves radiant heat transfer. #### 2. Thermal Design (Fin Structure) The "Cross-Cut" or straight fin design allows for airflow in multiple directions. The height (25mm) is optimized for high-profile cooling requirements in enclosures with active airflow (fans). #### 3. Attachment System (Push-Pins) The "R0" designation typically refers to the attachment kit. * **Push-Pins:** These provide a secure mechanical connection to the PCB. * **Compression Springs:** These ensure constant, even pressure on the thermal interface material (TIM), which is critical for efficient heat transfer between the chip and the heatsink. #### 4. Thermal Performance Thermal resistance is measured in **°C/W** (Degrees Celsius per Watt). A lower number means better cooling performance. * In a passive environment (no fan), the resistance is high (approx. 13.11°C/W). * Under forced convection (moving air), the performance increases significantly, dropping to approx. 3.32°C/W at 400 LFM (Linear Feet per Minute). --- ### Common Applications * **Embedded Systems:** Industrial PCs and controllers. * **Telecommunications:** High-speed routers and switches. * **Power Electronics:** Voltage regulators and power supplies.