The **ATS-04H-32-C1-R0** is a high-performance electronic thermal management component, specifically a **Heatsink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 54mm x 54mm x 12.7mm | | **Thermal Resistance** | 21.45°C/W (Unducted) | | **Fin Style** | Fine Pitch (Square Pattern) | --- ### 2. Key Design Features #### A. pushPIN™ Attachment Unlike standard adhesive tapes, this heatsink uses the **pushPIN™** system. * **Components:** It includes a flexible spring and a plastic/metal pin. * **Benefit:** Provides consistent pressure (clamping force) on the component, improving thermal interface material (TIM) performance and ensuring the heatsink stays secure during vibration. #### B. Material and Coating * **Aluminum 6063:** Offers a high strength-to-weight ratio and excellent thermal conductivity. * **Blue Anodized Finish:** Not only provides a professional aesthetic but also increases surface emissivity and protects the aluminum from corrosion. #### C. Airflow Optimization * The **Fine Pitch** design creates a high surface area within a low-profile height (12.7mm). * It is optimized for both **Natural Convection** (passive cooling) and **Forced Air** (active cooling with fans). --- ### 3. Thermal Performance Metrics Thermal resistance indicates how efficiently the part moves heat. Lower numbers are better. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural) | 21.45 | | 300 | 6.58 | | 500 | 3.27 | | 700 | 2.51 | --- ### 4. Typical Applications * **Telecommunications:** Cooling of networking switches and routers. * **Embedded Systems:** Industrial PCs where vertical clearance is limited. * **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators.