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  • ATS-04H-50-C1-R0

  • AI
    The **ATS-04H-50-C1-R0** is a high-performance electronic thermal management component, specifically an aluminum heat sink designed for cooling integrated circuits (ICs) and other electronic surface-mount devices. --- ### 1. Technical Specifications This part is manufactured by **Advanced Thermal Solutions (ATS)** as part of their **push-pin** heat sink series. | Property | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized Finish) | | **Dimensions** | 35.00mm x 35.00mm | | **Height** | 15.00mm | | **Attachment Type** | Push-Pin (Plastic) | | **Thermal Resistance** | 18.99 °C/W (at 100 LFM) | | **Fin Style** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (High performance pre-applied grease) | --- ### 2. Physical Design Features * **Fin Geometry:** It utilizes a "Straight Fin" design. This is optimized for **undirectional airflow**, meaning it works best when air is blown across the fins from one specific side to the other. * **Push-Pin Mounting:** Unlike adhesive-based heat sinks, this uses a spring-loaded push-pin mechanism. This provides: * **Consistent Pressure:** Ensures the heat sink stays firmly against the chip. * **Reliability:** Mechanical mounting is less likely to fail over time compared to double-sided tape in high-vibration environments. * **Blue Anodized Coating:** This is not just for aesthetics; the anodization increases the surface area at a microscopic level and protects the aluminum from oxidation. --- ### 3. Thermal Performance Profile Thermal resistance indicates how many degrees Celsius the component's temperature will rise for every Watt of power dissipated. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural/Low) | 18.99 | | 200 (Moderate) | 13.67 | | 400 (High) | 10.13 | --- ### 4. Typical Applications This part is commonly used in the following electronic systems: 1. **Networking Hardware:** Routers, switches, and modems. 2. **Embedded Systems:** Microcontrollers and SoCs (System on Chips) that generate moderate heat. 3. **Power Supplies:** Cooling voltage regulators or power transistors. 4. **Industrial PCs:** Compact computers requiring passive or active airflow cooling. ---
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole requirements for the push-pin mounting on this heat sink?
    • ⤷ How does the T766 thermal interface material compare to standard thermal pads?
    • ⤷ Can this heat sink be used in a vertical orientation for natural convection?