ATS-04H-50-C1-R0
AI

The **ATS-04H-50-C1-R0** is a high-performance electronic thermal management component, specifically an aluminum heat sink designed for cooling integrated circuits (ICs) and other electronic surface-mount devices.
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### 1. Technical Specifications
This part is manufactured by **Advanced Thermal Solutions (ATS)** as part of their **push-pin** heat sink series.
| Property | Specification |
| :--- | :--- |
| **Material** | Aluminum (Blue Anodized Finish) |
| **Dimensions** | 35.00mm x 35.00mm |
| **Height** | 15.00mm |
| **Attachment Type** | Push-Pin (Plastic) |
| **Thermal Resistance** | 18.99 °C/W (at 100 LFM) |
| **Fin Style** | Straight Fin |
| **Thermal Interface Material (TIM)** | T766 (High performance pre-applied grease) |
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### 2. Physical Design Features
* **Fin Geometry:** It utilizes a "Straight Fin" design. This is optimized for **undirectional airflow**, meaning it works best when air is blown across the fins from one specific side to the other.
* **Push-Pin Mounting:** Unlike adhesive-based heat sinks, this uses a spring-loaded push-pin mechanism. This provides:
* **Consistent Pressure:** Ensures the heat sink stays firmly against the chip.
* **Reliability:** Mechanical mounting is less likely to fail over time compared to double-sided tape in high-vibration environments.
* **Blue Anodized Coating:** This is not just for aesthetics; the anodization increases the surface area at a microscopic level and protects the aluminum from oxidation.
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### 3. Thermal Performance Profile
Thermal resistance indicates how many degrees Celsius the component's temperature will rise for every Watt of power dissipated.
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (Natural/Low) | 18.99 |
| 200 (Moderate) | 13.67 |
| 400 (High) | 10.13 |
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### 4. Typical Applications
This part is commonly used in the following electronic systems:
1. **Networking Hardware:** Routers, switches, and modems.
2. **Embedded Systems:** Microcontrollers and SoCs (System on Chips) that generate moderate heat.
3. **Power Supplies:** Cooling voltage regulators or power transistors.
4. **Industrial PCs:** Compact computers requiring passive or active airflow cooling.
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- ⤷
What are the PCB hole requirements for the push-pin mounting on this heat sink?
- ⤷ How does the T766 thermal interface material compare to standard thermal pads?
- ⤷ Can this heat sink be used in a vertical orientation for natural convection?