ATS-04H-81-C3-R0
AI

The **ATS-04H-81-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure.
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### 1. Technical Specifications
The following table outlines the physical and thermal properties of this specific model:
| Property | Specification |
| :--- | :--- |
| **Series** | pushPIN™ |
| **Material** | Aluminum (AL6063) |
| **Attachment Method** | Push-Pin (Plastic/Brass) |
| **Dimensions** | 30.00mm x 30.00mm |
| **Height (Fin)** | 20.00mm |
| **Fin Style** | Square Pattern (Straight/Cross-Cut) |
| **Thermal Resistance** | 14.22 °C/W @ Unducted Flow |
| **Finish** | Blue Anodized |
| **Thermal Interface Material** | T412 (Phase Change) |
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### 2. Key Components & Design Features
#### A. The Fin Design
The "81" in the part number indicates a specific fin density and geometry. This model utilizes a **square pattern** of fins which allows for multi-directional airflow. This is critical in compact electronic enclosures where air may not move in a perfectly straight path.
#### B. Push-Pin Attachment Mechanism
Instead of using messy adhesives or permanent solder, this part uses a **Push-Pin** system:
- **Spring-loaded:** Ensures constant, even pressure across the electronic component (die).
- **Tool-less:** Often allows for quick installation.
- **Reliability:** Prevents the heat sink from shifting during vibration or shipping.
#### C. Thermal Interface Material (TIM)
The part comes pre-applied with **T412**, a high-performance phase-change material.
- **Function:** It fills microscopic air gaps between the heat sink and the chip.
- **Benefit:** Reduces thermal contact resistance, ensuring the heat moves efficiently from the silicon into the aluminum fins.
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### 3. Part Number Breakdown (Nomenclature)
Understanding the suffix codes helps in identifying the exact variant:
* **ATS:** Manufacturer (Advanced Thermal Solutions).
* **04:** Attachment Type (Push-pin).
* **H:** High-performance fin geometry.
* **30x30x20:** Physical dimensions in millimeters.
* **C3:** Material/Color code (typically Blue Anodized).
* **R0:** Revision or specific packaging code.
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### 4. Typical Applications
* **Networking Equipment:** Routers, switches, and small-form-factor servers.
* **Embedded Systems:** Industrial PCs and automation controllers.
* **Consumer Electronics:** High-end audio processors or video encoding hardware.
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What is the significance of the 'Blue Anodized' finish in thermal management?
- ⤷ How does the 'Unducted Flow' thermal resistance rating affect my system design?
- ⤷ Are there alternative attachment methods if my PCB doesn't support push-pins?