The **ATS-04H-93-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this specific model: | Attribute | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions** | 40mm x 40mm x 15mm | | **Fin Type** | Straight Fin (Extruded) | | **Attachment Method** | pushPIN™ (Plastic/Brass) | | **Thermal Resistance** | 7.30°C/W (at 100 LFM) | | **Flow Orientation** | Directional (High surface area for airflow) | --- ### 2. Key Components & Design Features #### A. The pushPIN™ Attachment System One of the defining features of the "R0" series is the **pushPIN™** system. Unlike adhesive tapes or simple clips, this uses a spring-loaded mechanism to provide: * **Constant Pressure:** Ensures optimal contact between the heat sink base and the component. * **Secure Mounting:** Prevents the heat sink from shifting during vibration or shipping. * **Ease of Installation:** Uses pre-drilled holes in the PCB. #### B. Material and Coating * **Aluminum 6063:** Provides a high thermal conductivity-to-weight ratio. * **Blue Anodizing:** This is not just for aesthetics; anodizing increases the surface emissivity, allowing for better heat radiation and providing a layer of corrosion and wear resistance. #### C. Thermal Interface Material (TIM) The "C1" in the part number usually indicates the type of **Thermal Interface Material** pre-applied to the base. * ATS typically uses high-performance thermal pads or phase-change materials to bridge the microscopic air gaps between the heat sink and the chip. --- ### 3. Thermal Performance Profile The efficiency of the ATS-04H-93-C1-R0 depends heavily on the airflow (LFM - Linear Feet per Minute): | Airflow Velocity | Thermal Resistance (°C/W) | | :--- | :--- | | **100 LFM** | 7.30 | | **200 LFM** | 3.30 | | **400 LFM** | 1.80 | | **600 LFM** | 1.40 | *Note: Lower °C/W values indicate better cooling performance.* --- ### 4. Applications This part is commonly found in: * **Networking Equipment:** Routers, switches, and base stations. * **Embedded Systems:** Industrial PCs and automation controllers. * **Power Electronics:** Voltage regulators and motor drives.