ATS-05B-170-C2-R0
AI

The **ATS-05B-170-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc.** It is designed specifically for thermal management in electronic systems, particularly for cooling components like CPUs, GPUs, or power-dense integrated circuits.
### 1. Key Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum (Body), Copper (Optional Base depending on model) |
| **Thermal Resistance** | 5.44°C/W (at 100 LFM) |
| **Attachment Method** | Push-Pin (Plastic) |
| **Dimensions (L x W x H)** | 30mm x 30mm x 15mm |
| **Fin Style** | Straight Fin |
| **Finish** | Blue Anodized |
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### 2. Design and Components
#### Thermal Management (The Core)
The part uses a **straight-fin** design. This is optimized for high-velocity airflow environments where air is forced through the fins by a fan. The blue anodized finish is not just for aesthetics; it increases the surface emissivity, slightly improving heat radiation and protecting the aluminum from corrosion.
#### Attachment Mechanism: pushPIN™
This part features the ATS pushPIN™ system. This consists of:
* **Plastic Push Pins:** These snap into pre-drilled holes on the PCB (Printed Circuit Board).
* **Compression Springs:** These provide consistent pressure (known as "preload") between the heat sink and the electronic component to ensure maximum heat transfer.
* **Thermal Interface Material (TIM):** This part usually comes with a pre-applied Phase Change Material or thermal tape to fill microscopic air gaps between the component and the heat sink.
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### 3. Applications and Usage
This specific heat sink is typically used in:
* **Network Switches/Routers:** Cooling processors that handle high-speed data.
* **Embedded Systems:** Industrial PCs where space is limited but cooling is critical.
* **Power Supplies:** Regulating heat for voltage converters.
### 4. Comparison Table (Performance at Airflow)
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 5.44 |
| 200 (1.0 m/s) | 3.10 |
| 300 (1.5 m/s) | 2.48 |
| 400 (2.0 m/s) | 2.15 |
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- ⤷
What are the PCB hole diameter requirements for the push-pin attachment?
- ⤷ How does 'Blue Anodized' finish compare to 'Black Anodized' in terms of thermal performance?
- ⤷ Is there a specific Thermal Interface Material (TIM) recommended for this model?