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  • ATS-05B-170-C2-R0

  • AI
    The **ATS-05B-170-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc.** It is designed specifically for thermal management in electronic systems, particularly for cooling components like CPUs, GPUs, or power-dense integrated circuits. ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Body), Copper (Optional Base depending on model) | | **Thermal Resistance** | 5.44°C/W (at 100 LFM) | | **Attachment Method** | Push-Pin (Plastic) | | **Dimensions (L x W x H)** | 30mm x 30mm x 15mm | | **Fin Style** | Straight Fin | | **Finish** | Blue Anodized | --- ### 2. Design and Components #### Thermal Management (The Core) The part uses a **straight-fin** design. This is optimized for high-velocity airflow environments where air is forced through the fins by a fan. The blue anodized finish is not just for aesthetics; it increases the surface emissivity, slightly improving heat radiation and protecting the aluminum from corrosion. #### Attachment Mechanism: pushPIN™ This part features the ATS pushPIN™ system. This consists of: * **Plastic Push Pins:** These snap into pre-drilled holes on the PCB (Printed Circuit Board). * **Compression Springs:** These provide consistent pressure (known as "preload") between the heat sink and the electronic component to ensure maximum heat transfer. * **Thermal Interface Material (TIM):** This part usually comes with a pre-applied Phase Change Material or thermal tape to fill microscopic air gaps between the component and the heat sink. --- ### 3. Applications and Usage This specific heat sink is typically used in: * **Network Switches/Routers:** Cooling processors that handle high-speed data. * **Embedded Systems:** Industrial PCs where space is limited but cooling is critical. * **Power Supplies:** Regulating heat for voltage converters. ### 4. Comparison Table (Performance at Airflow) | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 5.44 | | 200 (1.0 m/s) | 3.10 | | 300 (1.5 m/s) | 2.48 | | 400 (2.0 m/s) | 2.15 | ---
    ✨ Follow-up Questions
    • ⤷ What are the PCB hole diameter requirements for the push-pin attachment?
    • ⤷ How does 'Blue Anodized' finish compare to 'Black Anodized' in terms of thermal performance?
    • ⤷ Is there a specific Thermal Interface Material (TIM) recommended for this model?