The **ATS-05D-159-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It is part of the "push-pin" series designed for cooling electronic components like CPUs, GPUs, and high-power chipsets. --- ## Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Brass) | | **Thermal Resistance** | 2.09°C/W (at 1.0 m/s airflow) | | **Fin Style** | XCUT (Straight Fins with cross-cuts) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## Key Design Components ### 1. Thermal Management The heat sink is designed to dissipate heat from integrated circuits (ICs). Its effectiveness is measured by its **thermal resistance**. Lower resistance values indicate better cooling performance. * **XCUT Fin Pattern:** This design increases surface area and creates turbulence in the airflow, which helps strip heat away from the aluminum fins more efficiently than standard straight fins. ### 2. Mounting Mechanism: Push-Pin Instead of using messy adhesives or complex clips, this part uses a **push-pin and spring** system. * **The Pin:** Usually made of brass or plastic. * **The Spring:** Provides constant vertical pressure (compression), ensuring that the heat sink maintains a tight, uniform contact with the electronic component even under vibration or thermal expansion. ### 3. Material and Finish * **Aluminum:** Chosen for its high thermal conductivity and lightweight properties. * **Blue Anodized Finish:** This is not just for aesthetics; anodizing increases the surface emissivity, slightly improving radiative heat transfer and protecting the metal from corrosion. ### 4. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. The TIM fills microscopic air gaps between the component die and the heat sink base, ensuring maximum heat conduction. --- ## Physical Dimensions ### Dimensions Table | Dimension | Size (mm) | | :--- | :--- | | **Length** | 45.00 mm | | **Width** | 45.00 mm | | **Height** | 10.00 mm | | **Pitch (Hole-to-Hole)** | 38.00 mm | --- ## Application Use Cases * **BGA (Ball Grid Array) Cooling:** Specifically sized for larger BGA chips. * **Embedded Systems:** Ideal for space-constrained enclosures due to its low 10mm profile. * **Networking Hardware:** Used in routers and switches to cool high-speed processing units.