The **ATS-05E-33-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the *push-pin* attachment series designed for cooling integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications Below are the primary technical parameters for this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W)** | 35mm x 35mm | | **Height** | 20mm | | **Thermal Resistance** | 17.42°C/W (Unducted Flow @ 100 LFM) | | **Attachment Method** | Push-Pin (Spring-loaded) | --- ### 2. Physical Design & Construction * **Fin Profile:** This model uses **Straight Fins**. This design is optimized for high-performance cooling where there is a clear, directional airflow provided by a system fan. * **Thermal Interface Material (TIM):** It typically comes pre-applied with **T766** phase-change material, ensuring a low-resistance thermal path between the heat source and the aluminum base. * **Push-Pin Mechanism:** It utilizes a brass or plastic push-pin with a stainless steel spring. This provides a constant, reliable pressure (load) on the component, improving heat transfer efficiency compared to simple adhesive tapes. --- ### 3. Performance Analysis The efficiency of the ATS-05E-33-C2-R0 depends heavily on the **Linear Feet per Minute (LFM)** of the airflow: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 17.42 | | 300 (1.5 m/s) | 4.65 | | 500 (2.5 m/s) | 2.98 | | 700 (3.5 m/s) | 2.25 | --- ### 4. Key Applications * **BGA Cooling:** Ideal for Ball Grid Array (BGA) processors and chipsets. * **PCB Components:** Used on Power Management ICs (PMICs) or high-speed FPGAs. * **Industrial Electronics:** Suitable for environments where vibration is present, as the push-pin mounting is more secure than adhesive solutions. ---