The **ATS-05F-131-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like CPUs, GPUs, and other integrated circuits. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Brass) | | **Thermal Resistance** | 3.60°C/W (at 200 LFM) | | **Base Dimensions** | 35.00mm x 35.00mm | | **Height** | 20.00mm | --- ### 2. Physical Design and Structure * **Cross-Cut Fin Pattern:** The unit features a "fine pitch" fin design. The cross-cut pattern allows for multi-directional airflow, making it versatile for systems where the direction of the cooling fan might vary. * **Material Selection:** It is made of lightweight aluminum, which offers excellent thermal conductivity while remaining cost-effective and light enough for PCB mounting. * **Blue Anodized Coating:** The blue finish isn't just for aesthetics; anodizing protects the aluminum from corrosion and slightly improves heat radiation. --- ### 3. Mounting System (Push Pin & Spring) The **"R0"** suffix indicates the specific mounting hardware included: 1. **Push Pins:** These are made of brass or plastic (usually brass in this series) and are designed to snap into pre-drilled holes in the PCB. 2. **Compression Springs:** Each pin has a spring that applies precise, uniform pressure on the component (TIM - Thermal Interface Material). This ensures maximum contact between the chip and the heat sink. 3. **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied. This is a phase-change material that melts during operation to fill microscopic air gaps between the chip and the heat sink. --- ### 4. Thermal Performance The efficiency of this heat sink is measured by thermal resistance (°C/W). Lower numbers are better. * **Unducted Airflow:** Performance varies significantly with air velocity (LFM - Linear Feet per Minute). * **Target Components:** It is ideally sized for medium-sized chips (35mm x 35mm) such as FPGAs, ASICs, or older generation chipsets. --- ### 5. Identification (Part Number Breakdown) * **ATS:** Advanced Thermal Solutions (Manufacturer) * **05:** Series/Internal designation * **F:** Fin Type (Fine) * **131:** Specific dimensions/model profile * **C2:** Material/Finish (Aluminum/Blue Anodized) * **R0:** Packaging/Mounting hardware revision