The **ATS-05F-197-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **push-pin** attachment series, specifically designed for cooling electronic components like processors, chips, and power modules. ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Base Part Number** | ATS-05F-197-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (2 holes) | | **Thermal Resistance** | 10.90°C/W @ (Unducted Flow) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 10.00mm | --- ### 2. Key Design Features #### A. Fin Profile (Straight Fin) This model uses a **straight fin** design. Straight fins are ideal for applications where there is a consistent direction of airflow (forced convection). They provide a large surface area to dissipate heat from the component into the surrounding air. #### B. Push-Pin Attachment Instead of using messy thermal adhesives or tapes, this unit uses a **spring-loaded push-pin** mechanism. * **Benefits:** Provides consistent pressure on the heat source for better thermal transfer. * **Hardware:** It typically uses brass or plastic pins with stainless steel springs. #### C. Material & Coating * **Aluminum:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodizing:** The coating protects the aluminum from corrosion and slightly increases emissivity, which aids in radiant cooling. --- ### 3. Thermal Performance Indicators The efficiency of this heat sink depends on the velocity of the air passing through the fins (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 10.90 | | 300 (1.5 m/s) | 5.13 | | 500 (2.5 m/s) | 4.02 | | 700 (3.5 m/s) | 3.44 | --- ### 4. Typical Applications * **Embedded Systems:** Cooling CPUs or GPUs on industrial motherboards. * **Telecommunications:** Cooling ASICs in networking switches and routers. * **Power Electronics:** Dissipating heat from high-speed transistors or voltage regulators. ---