The **ATS-05F-77-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to describe its physical and thermal properties. | Specification | Detail | | :--- | :--- | | **Product Type** | pushPIN™ Heat Sink | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 25.0mm x 25.0mm x 20.0mm | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Fin Type** | Fine Pitch (Straight Fin) | | **Thermal Resistance** | ~9.58 °C/W (at 100 LFM) | --- ### 2. Key Features * **pushPIN™ Attachment:** This system uses a spring-loaded pin mechanism to provide secure, consistent pressure on the heat source, improving thermal conductivity. * **Fine Pitch Fin Design:** The fins are spaced to maximize surface area while allowing for efficient airflow, making it ideal for systems with forced convection (fans). * **Pre-Applied TIM:** These units often come with a pre-applied **Thermal Interface Material (TIM)** on the base to ensure a low-resistance path between the component and the sink. * **Low Profile:** At 20mm height, it is suitable for compact electronic enclosures and 1U server environments. --- ### 3. Application Use Cases This specific heat sink is typically found in: 1. **Networking Equipment:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PCs and controllers. 3. **Power Electronics:** Cooling MOSFETs or Voltage Regulators. 4. **LED Lighting:** High-output LED thermal management. --- ### 4. Thermal Performance Data *Approximate performance based on airflow (LFM - Linear Feet per Minute):* | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural/Low) | 9.58 | | 200 | 4.57 | | 400 | 3.12 | | 600 | 2.50 | ---