The **ATS-05G-48-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. This part is designed to provide efficient cooling for electronic components such as CPUs, GPUs, FPGAs, and ASICs. Below is a detailed breakdown of its specifications and electronic integration characteristics. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-05G-48-C2-R0 | | **Heatsink Type** | Push-Pin (Passive Heat Dissipation) | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Dimensions** | 30mm x 30mm x 25mm | | **Fin Pattern** | Straight Fin (High Surface Area) | | **Attachment** | Brass Push-Pin (with Stainless Steel Spring) | | **Thermal Interface** | T766 (Pre-applied Phase Change Material) | --- ### 2. Physical and Design Characteristics * **Heat Dissipation Geometry:** The 25mm height allows for significant vertical surface area, making it ideal for systems with vertical airflow. * **Push-Pin Mounting:** This mechanism uses a spring-loaded pin that passes through pre-drilled holes in the Printed Circuit Board (PCB). It ensures consistent pressure on the electronic component, which is vital for maintaining low thermal resistance. * **Material Efficiency:** Using Aluminum 6063 provides a balance between lightweight construction and high thermal conductivity (approx. 200 W/m·K). --- ### 3. Electronic Application Usage This part is typically integrated into electronic assemblies where active cooling (fans) might be limited or where supplemental passive cooling is required for high-power chips. #### A. Thermal Performance Data (Approximations) * **Low Airflow (200 LFM):** ~4.30 °C/W thermal resistance. * **High Airflow (600 LFM):** ~2.10 °C/W thermal resistance. #### B. Compatibility * **Component Size:** Optimized for 30mm square chips. * **PCB Hole Pattern:** Requires a specific mounting hole distance (usually specified in the ATS technical drawing) to ensure the push-pins lock securely. --- ### 4. Key Advantages for Electronics 1. **Pre-applied TIM:** The T766 thermal interface material reduces assembly time and eliminates the risk of "starving" the chip of thermal paste or over-applying it. 2. **Spring Tension:** Prevents mechanical stress on the BGA (Ball Grid Array) solder joints while ensuring the heatsink doesn't shift during vibration or shipping. 3. **Anodized Finish:** The blue anodization is non-conductive and protects the aluminum from oxidation and environmental degradation.