The **ATS-05G-80-C2-R0** is a high-performance thermal management component, specifically an **Advanced Thermal Solutions (ATS) Push-Pin Heat Sink**. It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Number** | ATS-05G-80-C2-R0 | | **Heat Sink Type** | Push-Pin (XC Cut) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 19.03° C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 30mm x 30mm x 15mm | | **Attachment Method** | Push-Pin with Springs | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Design and Construction * **XC Cut (Cross-Cut) Pattern:** The fins are cut both vertically and horizontally. This design allows for multidirectional airflow, making it ideal for systems where the airflow direction is inconsistent or restricted. * **Material (Aluminum):** Provides a balance between lightweight construction and high thermal conductivity. The **Blue Anodized** coating improves surface emissivity and protects against corrosion. * **Push-Pin Mounting:** Unlike adhesive tapes, the push-pin mechanism uses a spring-loaded system to provide consistent pressure on the electronic component, ensuring better thermal contact and reliability during mechanical shocks. --- ### 3. Thermal Performance Indicators The efficiency of this part depends heavily on the **Linear Feet per Minute (LFM)** of the airflow provided by the system's fans: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural/Low) | 19.03 | | 200 | 13.91 | | 300 | 11.22 | | 500 | 8.82 | --- ### 4. Component Application This heat sink is typically used for: * **ASICs and FPGAs:** In networking equipment or industrial controllers. * **Power Converters:** Managing heat in DC-DC conversion modules. * **Embedded Systems:** Where space is limited (30x30mm footprint) but thermal dissipation is critical. ---