ATS-05H-34-C2-R0
AI

The **ATS-05H-34-C2-R0** is a high-performance electronic thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** Heat Sink series, designed specifically for cooling integrated circuits (ICs) and surface-mount devices (SMDs).
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### 1. Technical Specifications
The following table summarizes the physical and thermal properties of this specific model:
| Parameter | Specification |
| :--- | :--- |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Base Dimensions** | 35.00 mm x 35.00 mm |
| **Height** | 15.00 mm |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Thermal Resistance** | 6.73°C/W (at 1.0 m/s airflow) |
| **Flow Pattern** | High Velocity (Cross-Cut) |
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### 2. Key Component Features
#### A. Fin Design (Cross-Cut)
The unit features a **cross-cut fin pattern**, which allows for multidirectional airflow. This is particularly useful in dense electronic enclosures where the direction of the system fan's airflow might be obstructed or turbulent.
#### B. Attachment System (pushPIN™)
Instead of using messy thermal adhesives or tapes, this part uses a mechanical fastening system:
* **Compression Springs:** Ensure consistent pressure is applied to the chip, optimizing thermal interface material (TIM) performance.
* **Brass/Plastic Pins:** Secure the heat sink through pre-drilled holes in the PCB.
#### C. Thermal Interface Material (TIM)
The "R0" at the end of the part number indicates that the heat sink typically comes with **T766** pre-applied thermal interface material. This ensures immediate heat transfer from the processor to the aluminum base without air gaps.
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### 3. Application Use Cases
This specific height (15mm) and footprint (35mm) make it ideal for:
* **Networking Equipment:** Routers, switches, and modems.
* **Power Supplies:** Cooling MOSFETs or voltage regulators.
* **Industrial PCs:** Compact motherboards where vertical clearance is limited but high cooling efficiency is required.
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- ⤷
What are the different mounting hole patterns available for the pushPIN series?
- ⤷ How does the thermal resistance change at different airflow speeds (CFM)?
- ⤷ Can this heat sink be used with a custom thermal paste instead of the pre-applied TIM?