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  • ATS-05H-34-C2-R0

  • AI
    The **ATS-05H-34-C2-R0** is a high-performance electronic thermal management component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** Heat Sink series, designed specifically for cooling integrated circuits (ICs) and surface-mount devices (SMDs). --- ### 1. Technical Specifications The following table summarizes the physical and thermal properties of this specific model: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Base Dimensions** | 35.00 mm x 35.00 mm | | **Height** | 15.00 mm | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 6.73°C/W (at 1.0 m/s airflow) | | **Flow Pattern** | High Velocity (Cross-Cut) | --- ### 2. Key Component Features #### A. Fin Design (Cross-Cut) The unit features a **cross-cut fin pattern**, which allows for multidirectional airflow. This is particularly useful in dense electronic enclosures where the direction of the system fan's airflow might be obstructed or turbulent. #### B. Attachment System (pushPIN™) Instead of using messy thermal adhesives or tapes, this part uses a mechanical fastening system: * **Compression Springs:** Ensure consistent pressure is applied to the chip, optimizing thermal interface material (TIM) performance. * **Brass/Plastic Pins:** Secure the heat sink through pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) The "R0" at the end of the part number indicates that the heat sink typically comes with **T766** pre-applied thermal interface material. This ensures immediate heat transfer from the processor to the aluminum base without air gaps. --- ### 3. Application Use Cases This specific height (15mm) and footprint (35mm) make it ideal for: * **Networking Equipment:** Routers, switches, and modems. * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **Industrial PCs:** Compact motherboards where vertical clearance is limited but high cooling efficiency is required. ---
    ✨ Follow-up Questions
    • ⤷ What are the different mounting hole patterns available for the pushPIN series?
    • ⤷ How does the thermal resistance change at different airflow speeds (CFM)?
    • ⤷ Can this heat sink be used with a custom thermal paste instead of the pre-applied TIM?