The **ATS-06A-93-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) Heatsink**. It belongs to the "maxiFLOW™" series, designed for high-efficiency cooling in constrained airflow environments. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Base Part Number** | ATS-06A-93-C2-R0 | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 20.00mm | | **Thermal Resistance** | 7.37°C/W (at 100 LFM) | | **Flow Direction** | Open-ended for maximum air intake | --- ### 2. Key Electronic & Mechanical Components #### A. The Fin Geometry (maxiFLOW™) Unlike standard extruded heatsinks, the ATS-06A-93-C2-R0 uses a **tapered fin design**. This geometry is engineered to: * Increase the surface area for heat dissipation. * Reduce pressure drop (air resistance). * Maximize air velocity through the center of the fin field. #### B. The pushPIN™ Attachment System This part uses a specific mechanical interface to connect to the Printed Circuit Board (PCB): * **Spring-loaded Pins:** These ensure even pressure across the semiconductor (CPU/FPGA), which optimizes the thermal interface material (TIM) performance. * **Compression Springs:** They provide a precise "pull-down" force to prevent the heatsink from shifting during mechanical shock or vibration. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the type of thermal interface material pre-applied to the base: * **T766 Phase Change Material:** This is a high-conductivity substance that melts at operating temperatures to fill microscopic air gaps between the chip and the heatsink base. --- ### 3. Application Use Cases This component is typically found in the following electronic systems: 1. **Telecommunications:** Cooling for high-speed routers and switches. 2. **Embedded Systems:** Protecting Industrial PCs or controllers from overheating. 3. **Power Electronics:** Managing heat for MOSFETs or high-density power modules. --- ### 4. Code Representation (Thermal Simulation Input) If you were defining this part in a thermal simulation script (e.g., Python-based thermal modeling), it might look like this: ```python heatsink_specs = { "part_no": "ATS-06A-93-C2-R0", "material": "Aluminum 6063", "dimensions_mm": {"length": 40, "width": 40, "height": 20}, "thermal_resistance_lfm": { "100": 7.37, "200": 3.63, "300": 2.62 }, "mounting": "pushPIN_brass" } ```