ATS-06B-79-C3-R0
AI

The **ATS-06B-79-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors.
---
### 1. Technical Specifications
The part number follows a specific nomenclature used by ATS. Below are the key physical and thermal characteristics:
| Property | Description |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Spring-loaded pins) |
| **Dimensions (L x W x H)** | 25.0mm x 25.0mm x 30.0mm |
| **Fin Style** | Straight Fin |
| **Thermal Resistance** | ~2.63°C/W (at 200 LFM) |
| **Thermal Interface Material** | T412 (Pre-applied) |
---
### 2. Core Components & Design Features
#### A. The pushPIN™ Attachment System
Unlike adhesive-based heat sinks, this part uses the **pushPIN™** system. This consists of:
* **Plastic/Brass Pins:** Inserted into pre-drilled holes on the PCB.
* **Compression Springs:** Provide precise, consistent pressure across the component surface to maximize thermal transfer.
#### B. Straight Fin Geometry
The "straight fin" design is optimized for **forced air cooling** (fans). The vertical channels allow air to pass through with low pressure drop, making it efficient for systems with a clear airflow path.
#### C. Thermal Interface Material (TIM)
The unit comes with **T412** pre-applied to the base. T412 is a high-efficiency thermal tape that ensures there are no microscopic air gaps between the heat sink and the electronic chip, which is critical for preventing overheating.
---
### 3. Electronic Application
This part is typically used in the following electronic environments:
1. **Telecommunications:** Cooling signal processing chips in base stations.
2. **Embedded Systems:** High-density PCBs where vertical space is available (30mm height).
3. **Power Electronics:** Dissipating heat from VRMs (Voltage Regulator Modules) or MOSFETs.
---
### 4. Dimensional Drawing Summary
```text
25.0mm (W)
+----------+
| |||||| |
| |||||| | -- 25.0mm (L)
| |||||| |
+----------+
|| -- 30.0mm (Height)
```
- ⤷
What are the advantages of pushPIN™ over traditional adhesive mounting?
- ⤷ How does the 'Blue Anodized' finish affect thermal performance?
- ⤷ Is this heat sink suitable for passive cooling (no fan)?