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  • ATS-06B-79-C3-R0

  • AI
    The **ATS-06B-79-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS. Below are the key physical and thermal characteristics: | Property | Description | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W x H)** | 25.0mm x 25.0mm x 30.0mm | | **Fin Style** | Straight Fin | | **Thermal Resistance** | ~2.63°C/W (at 200 LFM) | | **Thermal Interface Material** | T412 (Pre-applied) | --- ### 2. Core Components & Design Features #### A. The pushPIN™ Attachment System Unlike adhesive-based heat sinks, this part uses the **pushPIN™** system. This consists of: * **Plastic/Brass Pins:** Inserted into pre-drilled holes on the PCB. * **Compression Springs:** Provide precise, consistent pressure across the component surface to maximize thermal transfer. #### B. Straight Fin Geometry The "straight fin" design is optimized for **forced air cooling** (fans). The vertical channels allow air to pass through with low pressure drop, making it efficient for systems with a clear airflow path. #### C. Thermal Interface Material (TIM) The unit comes with **T412** pre-applied to the base. T412 is a high-efficiency thermal tape that ensures there are no microscopic air gaps between the heat sink and the electronic chip, which is critical for preventing overheating. --- ### 3. Electronic Application This part is typically used in the following electronic environments: 1. **Telecommunications:** Cooling signal processing chips in base stations. 2. **Embedded Systems:** High-density PCBs where vertical space is available (30mm height). 3. **Power Electronics:** Dissipating heat from VRMs (Voltage Regulator Modules) or MOSFETs. --- ### 4. Dimensional Drawing Summary ```text 25.0mm (W) +----------+ | |||||| | | |||||| | -- 25.0mm (L) | |||||| | +----------+ || -- 30.0mm (Height) ```
    ✨ Follow-up Questions
    • ⤷ What are the advantages of pushPIN™ over traditional adhesive mounting?
    • ⤷ How does the 'Blue Anodized' finish affect thermal performance?
    • ⤷ Is this heat sink suitable for passive cooling (no fan)?