The **ATS-06D-153-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "blue ICE" series, specifically designed for cooling electronic components such as BGA (Ball Grid Array) packages, CPUs, or GPUs in space-constrained environments. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ Heat Sink | | **Base Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 20.00mm | | **Thermal Resistance** | 4.05 °C/W (at 100 LFM) | | **Airflow Pattern** | Fine-pitch straight fins (high efficiency) | --- ### 2. Key Electronic & Mechanical Components #### A. The Heat Sink Body (Passive Cooling) The body is constructed from high-quality aluminum. It uses a **high-performance fin pattern** designed to maximize surface area while minimizing pressure drop. This allows it to dissipate heat efficiently even in systems with low airflow. #### B. The pushPIN™ Attachment System Instead of using messy thermal adhesives or simple clips, this model uses a proprietary pushPIN™ system: * **Compression Springs:** These ensure constant, even pressure across the surface of the electronic component, which improves thermal transfer. * **Nylon/Plastic Pins:** These lock into pre-drilled holes in the Printed Circuit Board (PCB). * **Interchangeability:** The pins can be swapped with different lengths or materials (brass/plastic) depending on the PCB thickness. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the type of thermal interface material pre-applied to the base: * **Material:** T766 (High-performance thermal grease). * **Purpose:** It fills microscopic air gaps between the heat sink and the electronic chip to ensure maximum heat conductivity. --- ### 3. Applications in Electronics This specific heat sink is commonly found in: 1. **Networking Hardware:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PCs and automation controllers. 3. **Power Electronics:** Voltage regulators and high-density power modules. 4. **FPGA/ASIC Cooling:** Ensuring thermal stability for programmable logic devices. ---