ATS-06D-157-C2-R0
AI

The **ATS-06D-157-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **blueICE™** series and is specifically designed for cooling electronic components like CPUs, GPUs, and other high-heat integrated circuits.
---
### 1. Technical Specifications
The following table outlines the physical and thermal properties of the component:
| Feature | Specification |
|:---|:---|
| **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) |
| **Part Number** | ATS-06D-157-C2-R0 |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Dimensions** | 40mm x 40mm x 30mm |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Thermal Interface Material (TIM)** | T766 (Pre-applied) |
---
### 2. Design and Component Features
* **Heat Sink Profile:** It features a **Straight Fin** design. This is optimized for uniform airflow, typically provided by a nearby system fan or ducting.
* **pushPIN™ Attachment:** Instead of messy adhesives, this part uses a mechanical spring-loaded pin system. This ensures consistent pressure on the electronic component, which maximizes thermal transfer efficiency.
* **Thermal Performance:**
* **Unducted Flow:** 3.35 °C/W @ 100 LFM.
* **Ducted Flow:** 1.50 °C/W @ 100 LFM.
* **Material Science:** The use of **AL6063 aluminum** provides a balance between high thermal conductivity and structural rigidity. The **Blue Anodized** coating protects the aluminum from oxidation and increases surface emissivity.
---
### 3. Usage Example (Thermal Analysis)
When integrating this part into a PCB design, engineers look at the Thermal Resistance curve. Below is a conceptual representation of how one might calculate the temperature delta ($\Delta T$):
```python
# Simple Thermal Calculation
power_dissipation = 15 # Watts (Heat generated by the chip)
thermal_resistance = 1.8 # Celsius per Watt (estimated at specific airflow)
# Calculate Temperature Rise above Ambient
temp_rise = power_dissipation * thermal_resistance
print(f"The component will be {temp_rise} degrees Celsius above ambient.")
# Output: The component will be 27.0 degrees Celsius above ambient.
```
---
### 4. Application Areas
This specific heat sink is commonly used in:
1. **Telecommunications:** High-speed routers and switches.
2. **Embedded Systems:** Industrial PC modules and controllers.
3. **Power Electronics:** Cooling for MOSFET arrays or voltage regulators.
- ⤷What is the difference between ducted and unducted thermal resistance?
- ⤷ Does this heat sink come with different spring options for various PCB thicknesses?
- ⤷ How does the T766 thermal interface material compare to standard thermal paste?