The **ATS-06E-90-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of their "pushPIN™" series, designed for efficient cooling of integrated circuits (ICs) and other electronic components. ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 45.00mm x 45.00mm x 25.00mm | | **Pitch (Fins)** | Fine Pitch | | **Thermal Resistance** | 6.36°C/W (Unducted @ 100 LFM) | | **Weight** | ~48 grams | --- ### 2. Key Components & Design Features #### A. Fin Design (Straight Fin) The "90" in the part number refers to the specific fin pattern. This model utilizes a **straight-fin** design. This is ideal for applications where airflow is consistent and moves in a single direction across the component. #### B. pushPIN™ Attachment System Instead of using messy thermal adhesives or fragile clips, this part uses a standardized push-pin system. * **Spring-loaded:** Ensures even pressure across the surface of the chip for maximum heat transfer. * **Hardware:** Includes a brass or plastic pin and a high-performance compression spring. #### C. Interface Material (C2) The **"C2"** designation indicates that the heat sink comes pre-applied with a **T766 thermal interface material (TIM)**. This is a high-performance phase-change material that fills microscopic air gaps between the heat sink and the component, significantly reducing thermal resistance. --- ### 3. Electronic Application This part is typically used in the following scenarios: 1. **Processors & FPGAs:** Cooling high-speed logic devices in networking or industrial equipment. 2. **Power Supplies:** Managing heat for MOSFETs or power regulators. 3. **High-Density PCBs:** The 45mm footprint is a standard size for BGA (Ball Grid Array) packages. --- ### 4. Part Number Breakdown The nomenclature follows this logic: * **ATS:** Manufacturer (Advanced Thermal Solutions) * **06:** Series/Type * **E:** Size/Mounting configuration * **90:** Fin pattern/Height code * **C2:** Thermal Interface Material (T766) * **R0:** Revision/Packaging code