The **ATS-06F-112-C2-R1** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** Heat Sink Assembly line, designed to provide efficient cooling for electronic components like CPUs, GPUs, or high-power transistors. --- ### ## Technical Specifications Below are the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Product Type** | Heat Sink Assembly | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 26.30 °C/W (Unducted Flow) | | **Dimensions (L x W)** | 35.00 mm x 35.00 mm | | **Height** | 25.00 mm | | **Weight** | 68.00 grams | --- ### ## Component Breakdown #### 1. Thermal Management Performance The "C2" in the part number indicates the thermal performance level. It is designed for **fine-pitch** airflow environments. * **Unducted Flow:** 26.30 °C/W @ 100 LFM. * **Ducted Flow:** 2.63 °C/W @ 100 LFM (significant performance jump when airflow is contained). #### 2. Attachment System (pushPIN™) Instead of adhesive tapes, this model uses a mechanical mounting system: * **Springs:** Provides consistent pressure to ensure the thermal interface material (TIM) makes perfect contact with the chip. * **Push Pins:** Made of brass or plastic, designed to snap into pre-drilled holes in the PCB. #### 3. Thermal Interface Material (TIM) The "R1" suffix typically denotes the inclusion of a high-performance **T766 phase-change material** or a similar thermal pad pre-applied to the base of the heat sink, eliminating the need for separate thermal paste. #### 4. Fin Design The heat sink utilizes a **straight-fin** or **cross-cut** design (depending on the specific series iteration) to maximize surface area while minimizing pressure drop across the device. --- ### ## Typical Applications * **Embedded Systems:** Cooling for ARM-based processors. * **Power Supplies:** Heat dissipation for MOSFETs and Voltage Regulators. * **Telecommunications:** Cooling for ASICs in networking hardware.