The **ATS-06G-12-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for attachment to printed circuit boards (PCBs). ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Material** | Aluminum (with Blue Anodized Finish) | | **Attachment Method** | Push Pin (Plastic/Brass) | | **Thermal Resistance** | 15.86°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 12.70mm | | **Fin Style** | Straight Fin | | **Thermal Interface (TIM)** | T766 (High Performance) | --- ### 2. Key Electronic Features #### A. Thermal Performance The primary purpose of this part is to dissipate heat from electronic components (like CPUs, FPGAs, or MOSFETs) to the surrounding air. The "C2" in the part number indicates a specific thermal resistance profile designed for high-density electronic packaging where airflow might be constrained. #### B. The Push Pin Mechanism Unlike adhesive-based heat sinks, the **ATS-06G-12-C2-R0** uses a mechanical push-pin system. This provides several advantages: * **Consistency:** Ensures even pressure across the thermal interface material (TIM). * **Reliability:** Mechanical pins are less likely to fail over time compared to thermal tape in high-vibration environments. * **Serviceability:** The sink can be removed and replaced without damaging the component or leaving residue. #### C. Thermal Interface Material (TIM) This model comes pre-applied with **T766**, a high-performance phase-change material. This material fills the microscopic air gaps between the heat sink base and the electronic component to maximize heat transfer. --- ### 3. Part Number Breakdown | Segment | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Manufacturer) | | **06G** | Product Series / Fin Geometry | | **12** | Height of the heat sink (12.7mm) | | **C2** | Thermal Performance Grade / TIM Type | | **R0** | RoHS Compliant / Revision code | --- ### 4. Application Integration In an electronic circuit design, this part is used to keep the **Junction Temperature ($T_j$)** of a semiconductor within safe operating limits. Engineers select this specific part when they have a large surface area (54mm x 54mm) but limited vertical clearance (approx. 13mm).