The **ATS-06G-202-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push-pin" series designed for cooling electronic components such as CPUs, GPUs, and power modules. --- ### 1. Technical Specifications The following table highlights the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-06G-202-C2-R0 | | **Material** | Aluminum (Al) | | **Fin Style** | Straight Fin | | **Thermal Resistance** | 14.83 °C/W (@ 100 LFM) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 6.00mm | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Interface Material** | T766 (Pre-applied) | | **Finish** | Blue Anodized | --- ### 2. Key Electronic & Mechanical Components #### A. The Heat Sink Body The body is constructed from aluminum, which provides a balance between high thermal conductivity and low weight. The **Blue Anodized** finish is not just aesthetic; it provides surface protection against corrosion and slightly increases emissivity for better radiation heat transfer. #### B. Push-Pin Attachment Mechanism Instead of using adhesive tapes which can degrade over time, this part uses a mechanical push-pin system: * **Compression Spring:** Ensures constant pressure between the heat sink and the electronic component (IC). * **Precision Mounting:** Requires specific hole patterns on the PCB (typically 47mm spacing for this series). #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates the specific thermal interface material. * **T766:** This is a phase-change or high-performance thermal pad pre-applied to the base. * **Function:** It fills microscopic air gaps between the heat sink and the electronic chip to maximize heat transfer efficiency. --- ### 3. Thermal Performance Profile Thermal resistance determines how effectively the part moves heat away from the silicon. The performance varies based on the airflow (LFM - Linear Feet per Minute): * **Low Airflow (100 LFM):** 14.83 °C/W * **Medium Airflow (300 LFM):** 5.58 °C/W * **High Airflow (500 LFM):** 4.22 °C/W --- ### 4. Typical Applications This specific low-profile (6mm height) heat sink is commonly used in: 1. **Telecommunications:** Cooling networking chips in slim rack-mount servers. 2. **Embedded Systems:** Industrial PCs where vertical space is limited. 3. **Power Electronics:** Cooling MOSFET arrays or voltage regulators.