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  • ATS-06G-32-C2-R0

  • AI
    The **ATS-06G-32-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components. Below is a detailed breakdown of its specifications and physical attributes. ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin | | **Thermal Resistance (Flow)** | 21.46°C/W @ 100 LFM | | **Thermal Resistance (Static)** | 3.31°C/W @ 700 LFM | --- ### 2. Physical Dimensions This part is designed with a square footprint to fit standard BGA (Ball Grid Array) or FPGA packages. * **Length:** 35.00 mm * **Width:** 35.00 mm * **Height:** 15.00 mm * **Pin Pitch:** 40.00 mm --- ### 3. Key Electronic Cooling Features #### A. Fin Design The "06G" designation typically refers to the **Fine Pitch** fin geometry. This design increases the surface area available for heat dissipation, making it highly effective in systems with forced air cooling (fans). #### B. pushPIN™ Attachment Unlike adhesive tapes which can fail over time due to heat cycles, this part uses a mechanical push-pin system: * **Secure Fit:** Provides consistent pressure across the component for better thermal interface material (TIM) performance. * **Reliability:** Resistant to shock and vibration. * **Spring-Loaded:** Features a brass or plastic pin with a stainless steel spring to maintain tension. #### C. Material Properties * **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Coating:** Not only provides a professional aesthetic but also increases corrosion resistance and slightly improves emissivity for radiant cooling. --- ### 4. Typical Applications * **Embedded Systems:** Industrial PCs and controllers. * **Networking:** Routers, switches, and high-speed modems. * **Power Electronics:** Voltage regulators and power modules. * **Computing:** Secondary cooling for chipsets or small CPUs. ---
    ✨ Follow-up Questions
    • ⤷What is the difference between LFM and thermal resistance values in this context?
    • ⤷ How do I choose the correct spring tension for a push-pin heatsink?
    • ⤷ Does this heatsink come with pre-applied thermal interface material (TIM)?