ATS-06G-32-C2-R0
AI

The **ATS-06G-32-C2-R0** is a high-performance electronic thermal management component. Specifically, it is a **Heatsink** designed for cooling integrated circuits (ICs) and other electronic components.
Below is a detailed breakdown of its specifications and physical attributes.
### 1. Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) |
| **Series** | pushPIN™ |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin |
| **Thermal Resistance (Flow)** | 21.46°C/W @ 100 LFM |
| **Thermal Resistance (Static)** | 3.31°C/W @ 700 LFM |
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### 2. Physical Dimensions
This part is designed with a square footprint to fit standard BGA (Ball Grid Array) or FPGA packages.
* **Length:** 35.00 mm
* **Width:** 35.00 mm
* **Height:** 15.00 mm
* **Pin Pitch:** 40.00 mm
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### 3. Key Electronic Cooling Features
#### A. Fin Design
The "06G" designation typically refers to the **Fine Pitch** fin geometry. This design increases the surface area available for heat dissipation, making it highly effective in systems with forced air cooling (fans).
#### B. pushPIN™ Attachment
Unlike adhesive tapes which can fail over time due to heat cycles, this part uses a mechanical push-pin system:
* **Secure Fit:** Provides consistent pressure across the component for better thermal interface material (TIM) performance.
* **Reliability:** Resistant to shock and vibration.
* **Spring-Loaded:** Features a brass or plastic pin with a stainless steel spring to maintain tension.
#### C. Material Properties
* **Aluminum 6063:** Chosen for its excellent thermal conductivity and lightweight properties.
* **Blue Anodized Coating:** Not only provides a professional aesthetic but also increases corrosion resistance and slightly improves emissivity for radiant cooling.
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### 4. Typical Applications
* **Embedded Systems:** Industrial PCs and controllers.
* **Networking:** Routers, switches, and high-speed modems.
* **Power Electronics:** Voltage regulators and power modules.
* **Computing:** Secondary cooling for chipsets or small CPUs.
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- ⤷What is the difference between LFM and thermal resistance values in this context?
- ⤷ How do I choose the correct spring tension for a push-pin heatsink?
- ⤷ Does this heatsink come with pre-applied thermal interface material (TIM)?