The **ATS-06H-68-C2-R0** is a specific model of a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin | | **Thermal Resistance** | 15.31°C/W (at 100 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 15mm | | **Flow Orientation** | Vertical Fin (Straight) | --- ### 2. Key Components & Design Features #### A. Fin Design The "68" series features a **Straight-Fin** design. This is optimized for systems with a clear airflow path. The spacing between the fins is engineered to balance surface area with pressure drop, ensuring that air can pass through even at lower fan speeds. #### B. Push-Pin Attachment Unlike adhesive tapes or simple clips, this model uses a **Push-Pin** mechanism with a brass or plastic body and a stainless steel spring. * **Benefits:** Provides consistent pressure (clamping force) on the high-heat component, improving thermal interface material (TIM) performance. * **Requirement:** The PCB must have pre-drilled holes for mounting. #### C. Material & Coating * **Aluminum:** Chosen for its excellent thermal conductivity-to-weight ratio. * **Blue Anodization:** Not just for aesthetics; the anodized layer increases emissivity and protects the aluminum from corrosion and electrical shorts. --- ### 3. Thermal Performance Profile The effectiveness of this part varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural/Low) | 15.31 | | 300 (Moderate) | 5.07 | | 500 (High) | 3.52 | --- ### 4. Implementation Example If you are integrating this into a circuit, you would typically apply it as follows: ```markdown 1. Clean the component surface (e.g., FPGA) with Isopropyl Alcohol. 2. Apply a Thermal Interface Material (TIM) like thermal grease or a pad. 3. Align the ATS-06H-68-C2-R0 push-pins with the PCB holes. 4. Press down until the pins click into place. ```